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CXMT Now Looking To Produce LPDDR6

CXMT keeps hitting the headlines with its investments and desire to tackle the memory market, and now, it seems that it is looking to provide LPDDR6 to the world. So what exactly is CXMT looking to do, and could this be the first stepping stone that allows China to enter the world memory market?

CXMT, LPDDR6 memory, China memory market, DRAM production, advanced memory technology, AI memory chips, mobile device memory, SK Hynix LPDDR6, Apple memory sourcing, Chinese DRAM, memory market competition, memory supply chain, high-speed DRAM, LPDDR6 commercialization, memory price inflation, server memory solutions, consumer electronics memory, memory manufacturing China

Bourns Introduces FLP Series LTCC Low-Pass Filters Covering DC to 3.8 GHz

Bourns has introduced the FLP Series, a family of nine LTCC low-pass filters covering DC to 3.8 GHz for IoT, LTE, GNSS and 5G wireless communication designs.

Bourns, FLP Series, LTCC, Low-Pass Filter, RF Filter, Wireless Communications, IoT, LTE, GNSS, 5G, Passive Components, Ceramic Filter, RF Design, Electronic Components, PCB

Murata Introduces 1210 Common-Mode Choke for 10Base-T1S Automotive Ethernet

Murata has commercialized the DLW32MH241MX2, a 1210-size AEC-Q200 common-mode choke coil meeting OPEN Alliance Class 3 requirements for 10Base-T1S automotive Ethernet.

Murata, DLW32MH241MX2, Common Mode Choke, EMI Filter, Automotive Ethernet, 10Base-T1S, OPEN Alliance, AEC-Q200, Ferrite, Passive Components, EMC, Ethernet, Automotive, Noise Suppression, Electronic Components

Renesas Introduces Gen 3 DDR5 MRDIMM Chipset with 16,000 MT/s Performance

Renesas has introduced its Gen 3 DDR5 MRDIMM chipset, delivering up to 16,000 MT/s memory performance while maintaining compatibility with existing DDR5 server infrastructure.

Renesas, DDR5, MRDIMM, Memory, Server Memory, MRCD, MDB, DRAM, HPC, AI Servers, Data Centre, PMIC, SPD Hub, Memory Interface, Electronic Components

Toshiba Introduces 2 A Photorelays with Ultra-Low OFF-State Leakage

Toshiba has introduced the TLP3487 and TLP3491 photorelays, combining 2.0 A switching capability with ultra-low OFF-state leakage for semiconductor test systems.

Toshiba, Photorelay, Solid-State Relay, MOSFET, Semiconductor Test, Automated Test Equipment, ATE, P-SON4, Switching, Low Leakage, Test & Measurement, Logic IC, SoC, Memory Testing, Electronic Components

DigiKey Adds More Than 27,000 New Stocking Products and 104 Suppliers in Q2

DigiKey expanded its portfolio with more than 27,000 new stocking products and 104 suppliers during Q2 2026, increasing component availability across multiple categories.

DigiKey, Distribution, Electronic Components, New Products, New Suppliers, Connectors, Sensors, Inductors, ADCs, IoT, Industrial Electronics, Prototyping, Marketplace, Supply Chain, Electronics Distribution

Infineon Introduces Software-Configurable Wire Protection with SPOC Wire Guard Automotive eFuse

Infineon SPOC Wire Guard BTS80009 SWPx 1ES automotive eFuse combines software-configurable wire protection, integrated diagnostics, and fast fault isolation for software-defined vehicle architectures.

Infineon, SPOC Wire Guard, BTS80009 SWPx 1ES, Automotive eFuse, eFuse, Smart Power Switch, High-Side Switch, Automotive Electronics, Software-Defined Vehicle, SDV, I²t Wire Protection, Functional Safety, ASIL-D, ISO 26262, Power Distribution

Infineon Brings Solid-State Isolation to PVI Footprints with ISSI20BxxF Family

Infineon ISSI20BxxF Solid State Isolator family delivers higher drive capability, integrated protection, and 3 kVrms isolation in a compact PVI-compatible package.

Infineon, ISSI20B02F, ISSI20B03F, ISSI20B11F, Solid State Isolator, SSI, Photovoltaic Isolator, PVI, Solid State Relay, Industrial Automation, PLC, Coreless Transformer, Galvanic Isolation, Power Switching, PG-DSO-8

YAGEO Introduces SMD 0402 FC Pt-RTD Sensor for Compact Thermal Monitoring

YAGEO has launched the SMD 0402 FC Pt-RTD sensor, combining a compact 0402 package, fast thermal response, and long-term measurement stability for precision thermal monitoring.

YAGEO, SMD 0402 FC, Pt-RTD, Platinum RTD, Temperature Sensor, RTD Sensor, 0402 Sensor, Thermal Monitoring, Precision Temperature Measurement, Wearables, Medical Electronics, Industrial Equipment, DIN EN 60751

Ambiq Launches Apollo330 Plus and Apollo510 Lite Edge AI SoCs

Ambiq has launched the production-ready Apollo330 Plus and Apollo510 Lite SoCs, combining Arm Cortex-M55 processing, edge AI acceleration, wireless connectivity, and ultra-low-power operation.

Ambiq, Apollo330 Plus, Apollo510 Lite, Edge AI, Arm Cortex-M55, Helium, Microcontroller, SoC, Bluetooth LE, Matter, Thread, Wearables, Industrial IoT, Embedded AI, Low Power

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