Latest Components
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Bourns SRP2008DP PassivesDescription
Bourns SRP2008DP Shielded Power Inductors feature a low-profile, corrosion-resistant design with a metal alloy powder core for high current applications. These inductors offer high efficiency, low power loss, and operate from -40°C to +125°C. Ideal for DC-DC converters and compact electronic devices.
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SanDisk SDSDAF3-008G-XI PassivesDescription
SanDisk Industrial Grade SD and microSD cards are designed for high reliability and endurance in demanding industrial applications. They feature advanced memory management, power immunity, ECC, and wear leveling, with capacities from 8GB to 128GB. These cards are rugged, supporting wide temperature ranges and protection against water, shock, vibration, X-rays, and magnets.
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TDK B3292xU/V PassivesDescription
TDK B3292xU/V EMI Suppression Capacitors offer higher voltages and compact lead spacing, with capacitance ranging from 47nF to 20µF. These capacitors are rated at 350VAC and are designed to suppress interference in demanding industrial and automotive environments. They also feature excellent self-healing properties and AEC-Q200 compliance for durability.
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KEMET KEMET-CMC PassivesDescription
KEMET High-Performance Common Mode Coils are designed with nanocrystalline metal for SCFx series and Mn-Zn Ferrite cores for SCTx series. These coils offer a wide variety of sizes, shapes, and characteristics, featuring up to 22A rated current for single-phase and up to 110A for three-phase applications. They operate within a temperature range of -40°C to 130°C, making them suitable for various electronic devices.
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Marki Microwave BT2-0040, BTN-0050, BTN-0065 PassivesDescription
Marki Microwave RF Adapters are designed using a custom-made, resonance-free conical inductor to achieve superior broadband performance. They feature a straight or right-angle design with a frequency range of 40kHz to 65GHz. These adapters are ideal for test and measurement equipment applications, offering performance and reliability.
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TDK Corporation B3292xU/V PassivesDescription
The B3292xU/V series from TDK extends their X2 safety film capacitor portfolio, supporting voltages up to 350V (AC) with compact lead spacings. Designed for interference suppression in industrial and automotive applications, these capacitors offer excellent self-healing properties and AEC-Q200 compliance. They are ideal for use in on-board chargers, EV charging systems, and PV inverters.
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TDK HPL505028F PassivesDescription
TDK HPL505028F Wound Ferrite Inductors feature proprietary ferrite materials and a unique coil structure that ensures high reliability with reduced risk of open defects. They are designed to cancel magnetic flux, minimizing electromagnetic interference (EMI), and are capable of handling large currents efficiently. With an inductance range of 60nH to 150nH, these inductors are ideal for advanced driver assistance systems and ultra-high-current automotive applications.
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Bourns CE Monolithic Multilayer Chip Inductors PassivesDescription
Bourns CE Monolithic Multilayer Chip Inductors feature a monolithic structure that offers high reliability and low DC resistance in a compact form factor. These inductors have high self-resonant frequencies of up to 20,000MHz and an inductance range of 0.3nH to 470nH, making them suitable for various applications. They are ideal for RF amplifiers, low-voltage power supply modules, and wireless communication devices.
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Stackpole Electronics RNAN PassivesDescription
Stackpole Electronics RNAN High-Power Aluminum Nitride Substrate Resistors leverage advanced substrate technology to deliver high-power, high-reliability thin film chip resistors. The RNAN series offers exceptional power density with ratings ranging from 0.5W in the 0603 chip size to 6W in the 2512 chip size. These resistors maintain acceptable hot-spot and terminal temperatures while achieving high power levels.
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Fastron 0603LDM PassivesDescription
Fastron 0603LDM RF Inductors are designed for radio frequency (RF) applications that require optimal Q at high frequencies. These inductors feature gold flash pad metallization for better solderability and have a compact design. They are suitable for mobile telecommunications, automotive subsystems, and wireless communications.
