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Molex SInergy Modular High-Speed Hybrid Connectors ConnectorsDescription
Molex SInergy Modular High-Speed Hybrid Connectors support up to 25Gbps per lane in a modular form factor, suitable for aerospace, defense, and industrial applications. These connectors feature a rugged die-cast metal body, four-point contact system, and configurable bays for customizable signal and RF interfaces. They are qualified to MIL-DTL-83513 standards and designed to withstand extreme temperatures, vibration, shock, and moisture.
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Wakefield Thermal VC Series Thermal ManagementDescription
Wakefield Thermal VC Series Vapor Chambers are fluid-phase-change devices designed to transport heat efficiently from small sources to larger areas. Made from copper plates with an internal wick structure and sealed fluid, they provide high thermal performance and are lightweight. Ideal for applications in computers, data centers, telecommunications, aerospace, and transportation.
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Analog Devices Inc. AD4880 SemiconductorsDescription
The AD4880 is a dual-channel, 20-bit SAR ADC integrating fully-differential drivers, gain-setting resistors, low-drift reference buffers, LDO regulators, and decoupling capacitors to simplify precision signal-chain design. It supports simultaneous or independent sampling of two channels, optimized for input signals up to 1MHz with low noise, high linearity, and low power consumption. Ideal for applications such as digital imaging, spectroscopy, and high-speed data acquisition.
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Analog Devices Inc. AD698 SemiconductorsDescription
The AD698 is a complete monolithic signal conditioning subsystem that converts LVDT mechanical position into a unipolar or bipolar DC output with high accuracy and repeatability. It integrates all active circuit functions on a chip and requires only a few external passive components. The device supports half-bridge LVDTs, series-opposed 4-wire LVDTs, and RVDTs in precision position sensing systems.
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Analog Devices Inc. AD-GMSL792MIPI-EVK, AD-GMSL793MIPI-EVK SemiconductorsDescription
These kits provide a paired evaluation path for transporting MIPI CSI-2 camera data across GMSL3 or GMSL2 coax links in embedded vision and imaging systems. They support rapid bring-up of camera-to-processor links for robotics, industrial vision, ADAS prototyping, and other distributed sensing applications. Compatible with NVIDIA Jetson, Raspberry Pi, and AMD SoC platforms, they support cable lengths up to 15m for compact camera-link evaluation.
