Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

Not A Member? Join The Club Now!

TSMC Warns Major Chip Companies of Capacity Issues

An in-depth look at how AI-driven demand is reshaping the semiconductor industry, prolonging chip shortages, straining memory supplies, and raising questions about whether global electronics manufacturing can ever truly stabilise.

chip shortage, semiconductor industry, AI hardware, memory shortages, DDR5, TSMC, chip manufacturing, supply chain, data centers, electronics industry

Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

Samtec’s HSEC8 0.80 mm edge-card sockets use machined contacts to support high-speed, high-cycle modular systems.

Samtec, HSEC8, Generate series, edge card socket, 0.80 mm pitch, Edge Rate contact, high speed connector, signal integrity, modular systems, right angle connector, vertical connector, edge mount, power signal combo, PCB connector, datacom, telecom equipment, instrumentation, industrial electronics

EPC’s First Gen 7 eGaN FET Pushes Power Density in 40 V Designs

EPC’s new 40 V Gen 7 eGaN transistor offers low RDS(on) and reduced switching loss for compact, high efficiency power stages.

EPC, Efficient Power Conversion, EPC2366, GaN FET, eGaN transistor, Gen 7 GaN, 40 V FET, low RDSon, QG, synchronous rectification, DC DC conversion, AI servers, motor drives, power electronics, high density power, PQFN package

YAGEO’s Multi-Band GNSS Timing Antenna Targets Outdoor Synchronization Systems

YAGEO’s tri-band GNSS timing antenna supports L1, L2, and L5 operation for outdoor synchronization systems.

YAGEO Group, GNSSL125DM26NM, GNSS antenna, L1 L2 L5 GNSS, timing antenna, synchronization systems, RF design, outdoor enclosure, N-type connector, ceramic patch antenna, low noise amplifier, GNSS timing, network clocks, GNSSDO, base stations, small cell, smart grid, infrastructure timing, RF interference filtering

Worlds Smallest Capacitor Gets Smaller to Just 32nm

Researchers demonstrate a 32 nm vacuum-gap nanoelectromechanical capacitor, exploring how extreme miniaturization could influence future sensing, memory technologies, and nanoscale device research.

nanocapacitors, MEMS, NEMS, capacitors, nanoscale electronics, sensing technology, atomic force microscopy, DRAM scaling, semiconductor research, quantum electromechanics

RISC-V Processors Moving To a Datacenter Near You

Why RISC-V is poised to become the future of CPU design, exploring how open standards reduce barriers to entry, unify software ecosystems, and accelerate innovation across embedded systems, PCs, and data centers.

RISC-V, CPU architecture, open standards, instruction set architecture, processor design, semiconductor industry, embedded systems, data centers, computer architecture, open source hardware

RECOM’s Compact 480W DIN Rail Supply Targets High-Density Industrial Builds

A compact 52mm RECOM DIN rail supply providing 480W convection power for dense industrial control systems.

RECOM, RACPRO1-S480, DIN rail power supply, 480W PSU, industrial power, 24V rail, 48V rail, high-density power, convection cooled supply, active PFC, back-feed tolerance, automation systems, factory equipment, control cabinets, power design, industrial electronics

AI Growth Exposes New Fault Lines Across the 2026 Component Supply Chain

ASC Global outlines how rising AI demand is reshaping component availability and creating new supply pressures across key categories in 2026.

ASC Global, supply chain, component availability, 2026 market trends, AI demand, passive components, discretes, logic devices, procurement strategy, traceability, regional manufacturing, qualification cycles, automotive electronics, industrial systems, semiconductor supply dynamics, market analysis, sourcing challenges

Diodes PI2MEQX2505Q Improves MIPI D-PHY Signal Integrity In High Resolution Automotive Cameras

Diodes PI2MEQX2505Q restores MIPI D PHY signaling for high resolution automotive camera and ADAS systems with configurable equalization and low power modes.

Diodes Incorporated, PI2MEQX2505Q, ReDriver IC, MIPI D PHY, CSI2, DSI, signal integrity, equalization, pre emphasis, low power modes, automotive cameras, ADAS, high speed links, differential signaling, PCB routing, semiconductor, signal conditioning, camera systems, BEV electronics

Toshiba’s TB9104FTG Streamlines Control Of High Current Automotive Motors

Toshiba’s TB9104FTG gate driver uses SPI control to reduce wiring and MCU load in high current automotive motor systems.

Toshiba, TB9104FTG, gate driver, brushed DC motors, automotive motors, SPI control, PWM driver, body control modules, motor control, automotive electronics, AEC Q100, current sense amplifier, H bridge, dual half bridge, thermal management, MOSFET monitoring, automotive body systems

1 2 3 4 5 6 …43