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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

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Samtec Launches ARJ6 Cable Assembly for AI and PCIe 6.0 Systems

Samtec has introduced the ARJ6 cable-to-cable interconnect for PCIe 6.0, CXL 3.2, and 100 GbE applications. The assembly supports 112 Gbps PAM4 performance and removes PCB transitions from the signal path.

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Toshiba Adds Nine MOSFETs for 24V and 48V Industrial Power Systems

Toshiba has introduced nine N-channel MOSFETs for industrial power systems. The lineup includes 100V devices for 48V power rails and 60V devices for 24V systems in three package options.

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Belden Launches DiamonDrop Single-Fiber Cable for FTTX Installations

Belden has introduced PPC DiamonDrop, a single-fiber drop cable for FTTX deployments. The cable features a peelable jacket design, supports aerial and underground installation, and is compatible with industry-standard connectors.

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ROHM Launches 80V MOSFETs for Automotive 48V Power Systems

ROHM has introduced the AG16xFNxx Series of 80V automotive MOSFETs for 48V power systems. The devices are available in HPLF5060 and DFN3333 packages and comply with AEC-Q101.

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Nordic Launches nRF54L15 Tag for Asset Tracking Prototyping

Nordic nRF54L15 Tag is a compact wireless development platform for asset tracking, Bluetooth Channel Sounding, Matter, Apple Find My, and Google Find Hub applications based on the nRF54L15 SoC.

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RECOM Adds 6W DC/DC Converters with 4:1 Input Range

RECOM has introduced the REC6K-AW and REC6K-RW isolated DC/DC converter families. The 6W converters feature 4:1 input ranges, regulated outputs, protection functions, and isolation ratings up to 4000VDC.

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New Calculations Show Sub 2nm Transistors Are Possible

As engineers continue efforts to reduce the size of transistors, some are concerned that we are now hitting hard physical limits. But recent calculations and simulations have shown that sub 2nm devices are more than possible, opening up new opportunities for devices to continue getting smaller.

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Samsung First to Build 3D Stacked Transistors

Finally, it looks like that we may be entering the next era of semiconductor design, utilizing stacked transistor designs. Samsung has just announced that it is the first to achieve a 3D stacked design that could instantly double the number of devices on a die, and if their claims are true, could be a game-changer for the industry and technology as a whole.

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u-blox Launches MAYA-W5 and NORA-W5 Wi-Fi 6 Modules

u-blox has introduced the MAYA-W5 and NORA-W5 wireless module families with Wi-Fi 6 and Bluetooth Low Energy support. The modules are available in host-based and stand-alone versions for industrial and IoT applications.

u-blox, MAYA-W5, NORA-W5, Wi-Fi 6, 802.11ax, Bluetooth LE, Bluetooth Low Energy, Wireless Module, RF Module, IoT, Industrial IoT, Smart Building, Asset Tracking, Texas Instruments, CC3351, CC35x1E, Arm Cortex-M33, u-connectXpress

Toshiba Adds Low-Power Quad-Channel Digital Isolators for Industrial Systems

Toshiba's DCL341x0B series includes quad-channel digital isolators with 25 Mbps data transfer, 30 kV/μs CMTI, 3000 Vrms isolation, and power consumption of just 0.18 mA per channel for industrial and embedded applications.

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