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Würth Elektronik Launches WE-SFIA Flat-Wire Inductors

Würth Elektronik has launched the WE-SFIA SMT flat-wire inductor series for automotive DC/DC converters and filter chokes, with up to 158 A saturation current, 1.0 mΩ typical DCR, and operation from -40°C to +180°C.

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Micron Starts Shipping 245TB 6600 ION Data Center SSD

Micron has started shipping its 245TB 6600 ION data center SSD, targeting AI infrastructure, hyperscale storage, and cloud deployments where rack density, cooling efficiency, and power constraints are becoming major operational challenges.

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Samtec Adds Through-Hole Options to mPOWER Connectors

Samtec has expanded its ultra micro mPOWER connector family with through-hole PCB termination options for industrial, aerospace, and military systems requiring compact high-current interconnects with improved mechanical robustness and vibration resistance.

Samtec, mPOWER, Power Connectors, Through-Hole Connectors, Board-to-Board Connectors, Wire-to-Board, Rugged Electronics, Industrial Electronics, Aerospace Electronics, Military Electronics, PCB Connectors, High Current Connectors, Embedded Systems, Power Interconnects, Connector Systems, Electronic Components, Right Angle Connectors

Apple Now Considering Intel and Samsung For Future Devices over TSMC

In a move that some did not expect, Apple is floating the idea of looking at Samsung and Intel as its providers for custom chips over TSMC, now that TSMC supply is being taken over by AI industries. What challenges is the rise of AI introducing for those needing custom chips, what has Apple said, and what does this show us regarding the ongoing chip supply issues?

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Researchers Create New Memory Chip that Reduces Size and Power

Recently, researchers have developed a new memory chip that supposed breaks the rules of miniaturization, helping to solve the issues faced with overheating. What challenges does reducing memory technologies introduce, what did the researchers develop, and how could it help with the future of electronics?

memory chip, nanoscale memory, ferroelectric tunnel junction, FTJ memory, hafnium oxide, low power memory, energy efficient electronics, miniaturization in memory technology, semiconductor memory challenges, memory leakage, high density memory, AI hardware memory, IoT memory solutions, single-crystal memory, Institute of Science Tokyo

SiTime Elite 2 Targets Timing In AI GPU Clusters

SiTime’s Elite 2 Super-TCXO brings 1ns timing accuracy to AI data center synchronization, with MEMS stability, ±2ppb/°C frequency slope, 6 × 10⁻¹² ADEV, and compact package options.

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KYOCERA AVX Targets 48V Systems With New MLVs

KYOCERA AVX expands TransGuard VT Series with 48V multilayer varistors for automotive systems, offering high-temperature operation, 56V working voltage, and up to 1,500A surge handling.

KYOCERA AVX, TransGuard VT Series, Multilayer Varistor, MLV, 48V Automotive, Circuit Protection, Transient Voltage Suppression, TVS, Load Dump Protection, ESD Protection, Automotive Electronics, AEC-Q200, VDA-320, FLEXITERM, EMI Suppression, ZnO Varistor, High Temperature Electronics, Electric Vehicles, Power Electronics, Surge Protection, Industrial Electronics

XP Power AMF60 Brings 60W To Medical Wall Adapters

XP Power’s AMF60 series adds 60W wall-mount AC-DC adapters for medical, home healthcare, industrial, and ITE systems, with IP42 protection, 2 x MOPP isolation, global input, and low standby power.

XP Power, AMF60, AC-DC Power Supply, Wall-Mount Adapter, Medical Power Supply, Home Healthcare, Industrial Power Supply, External Power Supply, 60W Power Supply, IP42, DOE Level VI, DOE Level VII Ready, EU2019/1782, 2 x MOPP, IEC60601-1, IEC60601-1-11, ANSI/AAMI ES60601-1, UL62368-1, BF-Rated Medical Equipment, Patient Monitoring, Respiratory Care, Diagnostic Equipment, Imaging Systems, Test And Measurement

YAGEO C0G VW80808 MLCCs Target Automotive Flex Stress

YAGEO Group has introduced C0G VW80808 automotive-grade flexible termination MLCCs with AEC-Q200 and VW80808 compliance, 1000 pF to 6.8 µF capacitance, and 6.3 V to 1000 V ratings.

YAGEO, YAGEO Group, MLCC, multilayer ceramic capacitor, C0G capacitor, VW80808, AEC-Q200, flexible termination, FT CAP, automotive capacitors, passive components, flex crack mitigation, ECU, ADAS, powertrain electronics, DC-DC converter, inverter, BMS, onboard charger, automotive reliability

ROHM ML7670 And ML7671 Bring NFC Charging To Wearables

ROHM has launched the ML7670 and ML7671 NFC wireless power chipset for compact wearables, supporting 250 mW charging, WLC 2.0 compliance, embedded firmware, and small IC packages for smart rings and bands.

ROHM, ML7670, ML7671, wireless power, NFC charging, NFC wireless power, wearable electronics, smart rings, smart bands, smart pens, wireless earphones, power management IC, receiver IC, transmitter IC, NFC Forum WLC 2.0, FeliCa, 13.56 MHz, WL-CSP, WQFN, compact wearables, battery charging

Würth Elektronik Launches WE-SFIA Flat-Wire Inductors

Micron Starts Shipping 245TB 6600 ION Data Center SSD

Samtec Adds Through-Hole Options to mPOWER Connectors

Apple Now Considering Intel and Samsung For Future Devices over TSMC

Researchers Create New Memory Chip that Reduces Size and Power

SiTime Elite 2 Targets Timing In AI GPU Clusters

KYOCERA AVX Targets 48V Systems With New MLVs

XP Power AMF60 Brings 60W To Medical Wall Adapters

YAGEO C0G VW80808 MLCCs Target Automotive Flex Stress

ROHM ML7670 And ML7671 Bring NFC Charging To Wearables

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