Latest Components
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Qorvo QM55011EVB PowerDescription
The Qorvo QM55011EVB Development Tool is designed to evaluate the QM55011 IoT FEMs that are low-power cellular modules supporting multiple bands. These FEMs are multi-band multi-chip RF Front-End (RFFE) modules ideal for CIOT front ends, wearables, metering, and asset tracking. It supports NB-IoT1/2, Cat-M1/2, and Non-Terrestrial Networks (NTN) applications.
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Analog Devices / Maxim Integrated MAX20860A PowerDescription
The MAX20860A Step-Down Regulators are fully integrated, highly efficient, dual-phase DC-DC switching regulators with PMBus and AVSBus interfaces. They support a wide input voltage range of 5V to 16V and can deliver up to 120A load current. Ideal for applications in data centers, communications, and networking equipment.
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Analog Devices / Maxim Integrated MAX96793 PowerDescription
The MAX96793 DPHY Evaluation Kits are designed to evaluate the MAX96717/MAX96793 high-bandwidth Gigabit Multimedia Serial Link (GMSL) serializer. These kits support Windows 7 and Windows 10 software that provides a Graphical User Interface (GUI) for exercising features of the device. The kits include a board powered by USB, a 12V wall adapter, or an external power supply.
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Renesas Electronics RZ/G3E-EVKIT PowerDescription
The Renesas Electronics RZ/G3E-EVKIT Evaluation Board consists of a module board (SOM) and a carrier board, ideal for evaluating the features of the RZ/G3E MPU. It is designed for mid-range Human-Machine Interface (HMI) applications and complies with the SMARC v2.1 standard. This board serves as a good reference for module board-based product development.
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Renesas Electronics RZ/G3E PowerDescription
The Renesas Electronics RZ/G3E Arm® Cortex®-A55-Based Microprocessor is designed for mid-range Human-Machine Interface (HMI) applications, offering high-speed 5G connectivity and robust edge computing capabilities. It features a powerful quad-core Arm Cortex-A55 processor running at 1.8GHz, ideal for handling HMI workloads. The integrated AI accelerator (NPU: Ethos-U55) enables efficient on-device AI processing.
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Amulet Technologies GEMevaluation-Kits PowerDescription
Amulet Technologies Resistive and Capacitive GEMevaluation-Kits™ provide all necessary hardware for designing interactive and user-friendly color GUIs. The kits include GEMstudio™ software for rapid interface creation, suitable for prototyping and production. They are ideal for applications in industrial control systems, medical devices, and consumer electronics.
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WIZnet W6300 PowerDescription
The WIZnet W6300 Hardwired Dual TCP/IP Stack Controllers are designed for high-speed Internet of Things (IoT) applications, supporting Quad SPI for up to 100Mbps Ethernet communication. These controllers feature eight independent hardware sockets and a dual stack for IPv4/IPv6. They are available in low-power packages with features like Wake On LAN and Ethernet PHY Power Down Mode.
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NewAE Technology CW313 PowerDescription
The NewAE Technology SAM4S CW313 Target Board for ChipWhisperer® is based on the Atmel SAM4S microcontroller and includes the ATSAM4S2AA-MU, which has 128KB flash and 64KB SRAM. This board is designed to run various algorithms, including AES, RSA, and ECC, making it suitable for a wide range of applications. It is compatible with NewAE tools and is often used in tutorials provided by NewAE.
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Cincon CBM300S PowerDescription
Cincon CBM300S AC-DC Brick Power Supplies come in a 19.7mm ultra-low-profile package and provide up to 94% high efficiency. These power supplies feature a 90Vac to 264Vac input voltage range and continuous short-circuit protection. They operate from -40°C to 90°C temperature range and are designed for high power density applications.
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Omron Electronics G9EJH PowerDescription
Omron Electronics G9EJH DC Power Relays are designed for 800V DC systems built for pre-charging applications. These relays offer a compact, sealed solution for high-voltage DC switching, ideal for engineers designing in space-constrained environments. With a 30A switching capacity at 800V DC, the G9EJH enables efficient thermal management and layout flexibility.
