Latest Components
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Bourns SF-3812TL-TS PowerDescription
Bourns SF-3812TL-TS High-Voltage Brick SMD Fuses comply with UL 248-14, IEC 60127-1, and IEC 60127-7. This series features cap terminals with silver plating and is suitable for various industrial, medical, telecom, and power management applications. With a high interrupting capability of up to 50A at 250VAC, these fuses are both RoHS compliant and halogen-free.
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Silvertel EvalAg6810 PowerDescription
Silvertel EvalAg6810 Evaluation Board is designed to evaluate and demonstrate the Ag8610 PSE module. This board helps to pass through 10/100/1000BASE-T Ethernet data signals from a source onto any powered device connected to the output ports. Typical applications include Internet Protocol (IP) Cameras, audio-visual distribution, and industrial Ethernet.
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MEAN WELL ES-S PowerDescription
The MEAN WELL ES-S Portable Energy Storage Power Stations are available in three models with capacities of 0.5kWh, 1kWh, and 2.2kWh, designed for various power needs. Utilizing lithium iron phosphate (LiFePO4) technology, these stations offer superior energy density and a long lifespan, making them ideal for outdoor, home, and emergency applications. Equipped with multiple charging methods and output interfaces, they provide reliable power support for a wide range of devices.
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Ezurio NX611 PowerDescription
Ezurio Sona™ NX611 Development Kit is designed for the evaluation of Sona™ NX611 wireless modules, which integrate complete transmit/receive RF paths. These modules feature a full Wi-Fi subsystem powered by NXP's 802.11ax technology and are available in a 1218 76-pin LGA package. Typical applications include IoT and industrial requirements.
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Nexperia GANB1R2-040QBA & GANB012-040CBA PowerDescription
Nexperia GANB1R2-040QBA and GANB012-040CBA GaN HEMTs are 40V, 1.2mΩ or 12mΩ, bi-directional Gallium Nitride (GaN) High Electron-Mobility-Transistors (HEMTs). The GANB1R2-040QBA features a Very-Thin-Profile Quad Flat No-Lead package, while the GANB012-040CBA is available in a Wafer-Level Chip Scale package. Both devices deliver superior performance with ultra-low on-state resistance.
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Vishay / Dale IHXL2000VZ-3A PowerDescription
Vishay / Dale IHXL2000VZ-3A Automotive Through-Hole Inductors are AEC-Q200 qualified and feature a high temperature rating up to +155°C. These inductors handle high transient current spikes without saturation and are suitable for applications such as automotive high-current battery charging and brushless DC motors. The metal alloy construction provides excellent magnetic shielding and high thermal conductivity.
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M5Stack 195131191 PowerDescription
M5Stack Dial v1.1 Development Board is a high-performance, multifunctional embedded development board that represents a comprehensive upgrade of the original Dial product. It features a 1.28-inch round TFT touch screen, a high-precision rotary encoder, and supports multiple programming platforms like Arduino and UIFlow2. This board is ideal for smart home control, IoT, and educational maker projects.
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M5Stack A152-EU868 PowerDescription
The M5Stack A152-EU868 Atom DTU LoRaWAN-EU868 is a programmable Data Transmission Unit designed for the 868MHz frequency band. It features long-range communication with low power consumption and supports various LoRaWAN operation modes. Ideal for applications in smart agriculture and industrial monitoring.
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ROHM Semiconductor BM6GD11BFJ-LB PowerDescription
The ROHM Semiconductor BM6GD11BFJ-LB 1-Channel Gate Driver is designed for driving GaN HEMTs at high speeds with built-in isolation. It features a 2500V RMS isolation voltage and a maximum input/output delay time of 60ns. This gate driver is suitable for applications in industrial equipment, AC adapters, and server power supplies.
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ROHM Semiconductor BV1LB050FPJ-C PowerDescription
The ROHM Semiconductor BV1LB050FPJ-C is an AEC-Q100 qualified switch featuring a typical on-state resistance of 50mΩ. It includes built-in active clamp, dual thermal shutdown, and over current protection functions, making it suitable for automotive applications. This switch is packaged in a compact TO252-J3 form factor.
