Latest Components
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NXP i.MX 8ULP SemiconductorsDescription
The NXP i.MX 8ULP is an ultra-low power applications processor family featuring up to two Arm Cortex-A35 cores, an Arm Cortex-M33 core, advanced security with EdgeLock secure enclave, and integrated 3D/2D GPUs. It is designed for energy-efficient edge systems, offering over 20 power mode combinations and a dedicated power management subsystem. Ideal for smart home, appliance, and edge AI/ML applications.
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NXP SE051 SemiconductorsDescription
The NXP EdgeLock SE051 is a secure element designed for IoT security, offering updatability and support for custom applets. It features CC EAL 6+ certification, advanced cryptography, and a small HX2QFN20 package. Extensive software enablement and middleware support make it easy to integrate into microcontroller and microprocessor platforms.
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Nordic Semiconductor nRF21540 DB SemiconductorsDescription
The nRF21540 DB is a development bundle featuring both an evaluation kit (EK) and a development kit (DK) with an integrated nRF21540 RF front-end module for 2.4 GHz wireless range extension. It is designed for easy integration and testing with Nordic's nRF52 and nRF53 Series SoCs, supporting Bluetooth LE, Thread, Zigbee, and proprietary protocols. The bundle enables superior wireless range and robustness for applications such as industrial, smart home, and asset tracking.
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NXP MIMXRT1064DVL6A SemiconductorsDescription
The NXP iMX RT1064 is a high-performance crossover MCU based on the Arm Cortex-M7 core, operating at up to 600 MHz. It features extensive connectivity, memory, and multimedia support, making it ideal for applications like EV charging stations. The MCU is supported by MCUXpresso SDK, FreeRTOS, and Zephyr OS for rapid IoT development.
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Microchip LAN9360 SemiconductorsDescription
The LAN9360 is a fully integrated Ethernet Audio Video Bridging (AVB) endpoint solution for automotive applications. It supports uncompressed audio data transfers over Ethernet AVB networks and includes integrated AVB/TSN protocol stacks for seamless connectivity. Designed for compliance with IEEE, Avnu, and IETF standards, it enables rapid development of AVB-capable products.
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Microchip SW-TPDSv2 SemiconductorsDescription
The Trust Platform Design Suite v2 is Microchip's dedicated software platform for onboarding embedded security solutions. It supports Secure Element provisioning, development, and education for secure IoT applications. The suite is compatible with Windows, macOS, and Linux.
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Microchip SST26LF064RT SemiconductorsDescription
The SST26LF064RT is a 64-Mbit Radiation Tolerant Serial Quad I/O (SQI) flash memory device designed for high reliability in space and high-reliability applications. It features a high-speed 4-bit multiplexed I/O serial interface and is compatible with SPI protocol. Its proprietary SuperFlash® technology ensures low power consumption and enhanced performance.
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Microchip ATECC608B-TFLXTLS SemiconductorsDescription
The ATECC608B-TFLXTLS is a secure element designed for TLS systems, offering hardware-based cryptographic key storage and advanced security protocols such as ECDH and ECDSA. It comes pre-configured for common authentication use cases and is compatible with a wide range of MCUs and MPUs. Its ultra-low power consumption and small form factor make it ideal for IoT, industrial, and embedded applications.
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Renesas GreenPAK Family SemiconductorsDescription
The Renesas GreenPAK™ Family consists of cost-effective NVM programmable mixed-signal ICs that allow designers to integrate multiple system functions into a single custom circuit. These devices help reduce component count, board space, and power consumption while offering high reliability and design security. The GreenPAK Designer software enables rapid, graphical configuration and testing of custom circuits.
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Octavo Systems OSDZU3 SemiconductorsDescription
The OSDZU3 integrates a Xilinx Zynq UltraScale+ MPSoC, 2GB LPDDR4, power management, and essential components into a single compact BGA package. It simplifies system design and accelerates development by reducing complexity and board space. Ideal for high-performance embedded applications requiring flexibility and rapid time-to-market.
