Latest Components
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Texas Instruments TPS4812Q1EVM PowerDescription
Texas Instruments TPS4812Q1EVM Evaluation Module is designed to quickly and easily demonstrate the TPS4812-Q1 smart high-side driver. The module features a 3.5V to 95V operating range with two strong 2A gate drivers and offers bi-directional current monitoring with adjustable I2t for overcurrent protection. It is ideal for applications such as battery management systems and DC/DC converters.
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Texas Instruments TPSM336xx-Q1 PowerDescription
Texas Instruments TPSM336xx-Q1 Buck Converter Power Modules offer a 0.6A, 1A, or 2A, 36V input in a flip-chip on-lead package. The automotive, synchronous, step-down, DC/DC power module features integrated power MOSFETs and an AEC-Q200 qualified inductor. The small HotRod QFN package enhances thermal performance, ensuring high ambient temperature operation.
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Texas Instruments LMG2656 PowerDescription
Texas Instruments LMG2656 650V GaN Power-FET Half Bridge simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm by 8mm QFN package. It features programmable turn-on slew rates for EMI control and low-side current-sense emulation to reduce power dissipation. This component is ideal for applications like AC/DC adapters and chargers.
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Texas Instruments LM65460EVM PowerDescription
The Texas Instruments LM65460EVM Evaluation Module allows users to evaluate the operation of the LM654x0-Q1. This synchronous, step-down converter can supply up to 4A, 6A, or 8A of load current from an input voltage as high as 36V. It features minimized switch node ringing to reduce Electromagnetic Interference (EMI).
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Texas Instruments INA2227EVM PowerDescription
The Texas Instruments INA2227EVM Evaluation Module is designed to quickly and easily demonstrate the INA2227. It features a dual-channel 16-bit digital current monitor with an I2C/SMBus-compatible interface, supporting current measurements up to 10A per channel. The module includes GUI support for reading and writing to device registers.
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Texas Instruments LMR60430-Q1 PowerDescription
Texas Instruments LMR60430-Q1 Synchronous Buck Converters are designed for automotive applications, operating from 3V to 36V with a maximum transient of 42V and delivering up to 3A. They feature an ultra-compact HotRod QFN-9 package that minimizes inductance and enhances EMI performance. The converters support a wide range of output voltages and include modes for efficient operation.
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Nexperia NEX13120xPC PowerDescription
Nexperia NEX13120xPC Evaluation Boards allow users to assess the functionality and performance of NEX13120FPC-Q100, a 12-bit automotive 12-channel LED driver featuring a UART interface. The boards are AEC-Q100 Grade 1 qualified and developed for high-side applications, supporting a 4.5V to 36V VBAT input range. They are ideal for automotive lighting applications including exterior rear lights and interior ambient lights.
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M5Stack A134-V2 SensorsDescription
M5Stack A134-V2 ATOMIC GPS Base v2.0 is a GPS positioning module based on the Atom series of hosts. It features a high-performance AT6668 chip with a built-in MAX2659 low-noise amplifier, providing accurate satellite positioning services. This device supports multiple satellite navigation systems and offers a maximum positioning update rate of 10Hz.
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Chip Quik CQ-ESD ConnectorsDescription
Chip Quik CQ-ESD Tweezers are designed for precision electronic assembly, constructed from stainless steel with an antistatic, anticorrosion, and antiglare ESD painted handle. The nonmagnetic design ensures durability with a hardness of HRC40. Available in lengths ranging from 110mm to 140mm, these tweezers meet a variety of assembly needs.
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TE Connectivity D2D ConnectorsDescription
TE Connectivity's D2D Dual Mode Antennas provide dual-mode capability for both terrestrial and non-terrestrial networks, enabling direct communication with LEO satellites. These antennas are suitable for various applications including remote monitoring, transportation, and IoT endpoints. They are designed to meet RSRP levels and are ruggedized for durability.
