Latest Components
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STMicroelectronics ST25R300 PowerDescription
The STMicroelectronics ST25R300 NFC Reader is a high-performance universal device supporting NFC initiator, target, reader, and card emulation modes. It is optimized for challenging POS terminal applications and complies with EMVCo PCD 3.2a standards. The device features a wide power supply range and is well-suited for all NFC applications.
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Monolithic Power Systems (MPS) MPM3901 PowerDescription
The MPM3901 Synchronous Step-Down Power Modules are fully integrated, fixed-frequency modules designed for automotive applications. They can deliver up to 1A of continuous output current with a wide input voltage range of 4.5V to 60V. With features like low quiescent current and built-in protection mechanisms, these modules are ideal for battery-powered applications.
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TDK CGA Automotive Grade Soft Termination MLCCs PassivesDescription
TDK CGA Automotive Grade Soft Termination Multilayer Ceramic Chip Capacitors (MLCCs) incorporate a conductive resin layer into the terminal electrodes, protecting the ceramic body from cracks. These capacitors feature 4.7μF or 10μF capacitance and come in 3225 (1210") dimensions. They are ideal for fail-safe designs in battery lines, mobile devices, and smart keys.
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Renesas Electronics RAJ240055 PowerDescription
The Renesas Electronics RAJ240055 R-BMS F Evaluation Kit is designed for small vacuum cleaners, robotic vacuums, and consumer and medical devices, supporting 2 to 4S cell configurations. It features a Li-ion battery FGIC that integrates MCU and AFE blocks for efficient battery management. This evaluation kit allows for easy transition from evaluation to customer qualification without the need for firmware development.
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Renesas Electronics RAJ240090/100 PowerDescription
The Renesas Electronics RAJ240090/100 R-BMS F Evaluation Kit is a 3 to 10S cell (~12V to 40V) solution operated by the RAJ240100 and RAJ240090 Li-ion battery FGICs. It is designed for applications such as e-bikes, e-mobility, and robotics, providing a complete evaluation system for battery management. The kit includes an evaluation module, USB SMBus interface, and user-friendly firmware for easy configuration.
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NXP Semiconductors P3A1604UK ConnectorsDescription
The NXP Semiconductors P3A1604UK is a versatile 4-bit device designed for bidirectional voltage level translation with auto direction sensing. It supports a wide supply voltage range and is ideal for I3C, I2C, SMBus, and SPI applications, offering a maximum data rate of 40Mbps. This transceiver is perfect for mobile, industrial, and consumer applications, providing seamless integration and efficient voltage level translation.
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NXP Semiconductors P3A1604UK-ARD PowerDescription
The NXP Semiconductors P3A1604UK-ARD Arduino® Shield Evaluation Board is designed to facilitate easy voltage translation between different logic levels. It supports connections to I2C, I3C, or SPI controllers, translating voltages between VCCA (0.72V to 1.98V) and VCCB (1.62V to 3.63V). This board is ideal for prototyping and testing in consumer electronics and industrial applications.
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Vishay / Dale IFCL PassivesDescription
Vishay / Dale IFCL Coupled Ferrite Power Inductors are dual-winding inductors designed for various applications including SEPIC converters and LED lighting. They feature highly coupled windings and operate within an inductance range of 0.5μH to 1000μH. These inductors are constructed with magnetically shielded ferrite and are halogen-free, Pb-free, and RoHS compliant.
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Ezurio Sona Wi-Fi 6/6E ConnectorsDescription
Ezurio Sona™ Wi-Fi® 6/6E Modules are designed for industrial IoT connectivity with access to SDIO and UART interfaces. These next-gen wireless IoT modules feature an industrial operating temperature range, Wi-Fi, BLUETOOTH® LE, and a pluggable card. The Ezurio 6/6E modules are housed in SMT M.2 packaging.
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Altera/Intel AGILEX3 SemiconductorsDescription
Altera/Intel Agilex™ 3 FPGA and SoC FPGAs are power and cost-optimized devices engineered in compact form factors for various applications. The highly flexible Agilex 3 features the capabilities and characteristics required by next-generation platform management solutions. With on-chip dual Arm® Cortex®-A55 cores and hardened peripherals, these devices offer a high degree of functionality in a small package.
