Latest Components
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NXP IW61x SemiconductorsDescription
The NXP IW61x is a highly integrated single-chip solution featuring dual-band Wi-Fi 6 (802.11ax), Bluetooth 5.2, and 802.15.4 radios for IoT and industrial applications. It enables efficient coexistence of multiple wireless protocols, reducing system cost and complexity. Ideal for smart home, industrial automation, and gateway devices.
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NXP IW416 SemiconductorsDescription
The NXP IW416 is a highly integrated System-on-Chip (SoC) supporting dual-band Wi-Fi 4 and Bluetooth 5.2 connectivity. It enables simultaneous or arbitrated operation of Wi-Fi and Bluetooth, with advanced coexistence hardware and algorithms for optimal performance. The device is ideal for smart home and IoT applications requiring robust wireless communication.
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NXP MIMXRT1166DVM6A SemiconductorsDescription
The i.MX RT1160 Evaluation Kit is a high-performance development platform featuring a dual-core Arm Cortex-M7/M4 MCU running up to 600 MHz. It offers extensive connectivity, multimedia, and security features, making it ideal for consumer, industrial, and automotive applications. The kit includes memory, debug options, and expansion connectors for rapid prototyping.
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NXP i.MX 93 SemiconductorsDescription
The NXP i.MX 93 is a power-efficient applications processor family featuring Arm Cortex-A55 cores, integrated ML acceleration, and advanced security with EdgeLock secure enclave. It is designed for energy-efficient edge computing in industrial, IoT, and automotive applications. The i.MX 93 offers a rich set of peripherals and supports multiple operating systems.
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NXP i.MX 8XLite SemiconductorsDescription
The NXP i.MX 8XLite is a scalable applications processor designed for telematics, V2X, and industrial control. It features Arm Cortex-A35 and Cortex-M4F cores, advanced security modules, and extensive connectivity options. Ideal for automotive and industrial applications requiring efficient performance and high security.
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NXP i.MX 8ULP SemiconductorsDescription
The NXP i.MX 8ULP is an ultra-low power applications processor family featuring up to two Arm Cortex-A35 cores, an Arm Cortex-M33 core, advanced security with EdgeLock secure enclave, and integrated 3D/2D GPUs. It is designed for energy-efficient edge systems, offering over 20 power mode combinations and a dedicated power management subsystem. Ideal for smart home, appliance, and edge AI/ML applications.
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NXP SE051 SemiconductorsDescription
The NXP EdgeLock SE051 is a secure element designed for IoT security, offering updatability and support for custom applets. It features CC EAL 6+ certification, advanced cryptography, and a small HX2QFN20 package. Extensive software enablement and middleware support make it easy to integrate into microcontroller and microprocessor platforms.
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NXP BYLink System Power Platform PowerDescription
The NXP BYLink System Power Platform is a scalable and expandable power management solution designed for complex SoCs and multiple peripherals in industrial and automotive applications. It integrates various NXP PMIC devices to work together as a single, safe, and flexible power solution. The platform supports multi-vendor processors and simplifies safety analysis and power sequencing.
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Nordic Semiconductor nRF21540 DB SemiconductorsDescription
The nRF21540 DB is a development bundle featuring both an evaluation kit (EK) and a development kit (DK) with an integrated nRF21540 RF front-end module for 2.4 GHz wireless range extension. It is designed for easy integration and testing with Nordic's nRF52 and nRF53 Series SoCs, supporting Bluetooth LE, Thread, Zigbee, and proprietary protocols. The bundle enables superior wireless range and robustness for applications such as industrial, smart home, and asset tracking.
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STMicroelectronics STEVAL-DPSTPFC1 PowerDescription
The STEVAL-DPSTPFC1 is a 3.6 kW bridgeless totem pole boost circuit reference design featuring digital power factor correction (PFC) and an inrush current limiter. It utilizes advanced ST power devices including a SiC MOSFET, SCR, isolated FET driver, and a 32-bit MCU for high efficiency and low THD. This robust design meets EMC standards and is ideal for compact, high-performance power conversion applications.
