Microchip has introduced a new family of 3.3 kV HV-D3 mSiC power modules aimed at solid-state transformer designs for AI data centers and other medium-voltage power systems. The modules combine silicon carbide MOSFETs and Schottky diodes inside an industry-standard 62 mm package and are intended for direct conversion from medium-voltage grid infrastructure to server-level power systems.
The HV-D3 series is a silicon carbide power module used in high-voltage conversion systems where efficiency, thermal performance, and power density are becoming harder to balance using conventional transformer architectures. Microchip is positioning the modules around solid-state transformer designs, where higher switching frequencies and fewer conversion stages can reduce system losses while increasing power available at the rack level.
The launch comes as AI data centers continue pushing power demand higher. Traditional low-frequency transformer systems remain effective for bulk power conversion, but they also introduce additional conversion stages, larger magnetic components, and less flexibility in how power is distributed through the facility.
3.3 kV SiC Devices Reduce Series Connections
The HV-D3 modules pair Microchip’s mSiC MOSFETs with Schottky diodes in a 62 mm power module. The 3.3 kV rating is important in medium-voltage systems because fewer devices are needed in series when connecting into 13.8 kV or 34.5 kV grid infrastructure. Microchip puts that reduction at roughly half compared with lower-voltage SiC options. That becomes more relevant in SST designs where series-connected devices quickly affect layout complexity, protection circuitry, switching behavior, and thermal management.
The modules are available in half-bridge and common-source configurations, with versions offered both with and without anti-parallel Schottky diodes. Current handling covers the 100A to 300A range, which sits between smaller discrete SiC devices and much larger industrial power modules.
Thermal And Isolation Requirements In SST Designs
The package supports 6 kV isolation and uses CTI 600-rated materials. It also has longer creepage distances for high-voltage layouts where multiple devices may be connected in series. A silicon nitride substrate is used to improve thermal conductivity and power-cycling capability. In SST designs, that helps move some of the thermal work back into the module instead of forcing the rest of the system to compensate with more cooling hardware.
Power density is becoming a larger issue across AI infrastructure as rack power levels continue increasing. Reducing conversion losses earlier in the power chain is one reason solid-state transformers are attracting more attention in medium-voltage distribution systems.
AI Infrastructure Is Only One Target Market
While the immediate focus is AI data center power delivery, the HV-D3 family also targets several other medium-voltage applications where high-frequency SiC switching and thermal robustness are important. That includes megawatt charging systems for heavy-duty electric vehicles, rail auxiliary power systems, medium-voltage motor drives, industrial infrastructure, and defense power platforms.
The mSiC MOSFETs are specified for both hard-switched and soft-switched topologies, which gives the modules room to be used across different converter designs rather than only one switching approach.
Microchip is also providing an application note, design guide, device models, simulation models, design services, and field application engineering support.
Learn more and read the original announcement at www.microchip.com
Technology Overview
Microchip’s HV-D3 mSiC series is a family of 3.3 kV silicon carbide power modules designed for medium-voltage power conversion systems. The modules integrate SiC MOSFETs and Schottky diodes in a 62 mm package with 6 kV isolation, silicon nitride substrates, and support for 100A to 300A operating ranges. Configurations include half-bridge and common-source topologies.
View the HV-D3 mSiC datasheet
Frequently Asked Questions
What are the Microchip HV-D3 mSiC modules used for?
The HV-D3 modules are designed for medium-voltage power conversion applications including solid-state transformers, AI data center infrastructure, heavy-duty EV charging, rail systems, and industrial motor drives.
Why are 3.3 kV SiC modules important in solid-state transformers?
Higher-voltage SiC devices can reduce the number of series-connected components required in medium-voltage converter systems, helping simplify layout, thermal management, and protection design.
What package format does the HV-D3 family use?
The modules use an industry-standard 62 mm package with 6 kV isolation and silicon nitride substrate technology for improved thermal performance.
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