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Texas Instruments Adds EIS Technology to 26-Cell Battery Monitor

Texas Instruments has introduced the BQ79826Z-Q1 battery monitor with an integrated EIS engine and support for up to 26 series-connected cells. The device delivers less than 2 mV voltage accuracy, supports ASIL-D functional safety requirements, and targets EV and energy storage battery management systems.

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Nexperia Brings QDPAK Packaging to 1200 V SiC MOSFETs

Nexperia has introduced 1200 V SiC MOSFETs in QDPAK top-side cooled packaging. The portfolio includes 17 mΩ to 80 mΩ variants, delivers up to 3 kW higher output power than D2PAK-7 devices, and targets EV, industrial, renewable energy, and datacenter power systems.

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Samtec FTSH Terminal Strips Support JTAG Connectivity

Samtec FTSH series provides 1.27 mm pitch terminal strips for JTAG, board-level interconnect, and cable assembly applications. The family includes SMT and through-hole options, up to 50 positions per row, and compliance with MIL-DTL-55302 testing requirements.

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Researchers Create Multi-Function Transistor That Could Shrink Designs By 75%

In a world where reducing transistor sizes is beginning to have less of an effect on device density, researchers are trying to find new ways of packing more transistors on chips. Now, researchers claim to have created a new multi-function transistor that can shrink down designs as much as 75%.

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YAGEO Introduces MB-Series Pt-RTDs With Nickel Lead Wires

YAGEO has introduced the MB-Series Pt-RTD temperature sensors featuring nickel lead wires, DIN EN 60751 compliance, operating temperatures from -70°C to 500°C, and 100 Ω and 1000 Ω options for HVAC, appliance, and industrial applications.

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onsemi Launches Elite Pairing Studio for SiC Power Design

onsemi has introduced Elite Pairing Studio, an online environment for evaluating SiC MOSFET and gate driver combinations. The platform provides waveform analysis, switching-loss calculations, and integration with PLECS and Elite Power Simulator workflows.

onsemi, Elite Pairing Studio, SiC MOSFET, Silicon Carbide, Gate Driver, Power Electronics, Simulation Software, Engineering Tools, PLECS, Elite Power Simulator, AI Data Centers, Electric Vehicles, Industrial Systems, Switching Losses, Waveform Analysis, Power Conversion, Design Simulation

EPC Introduces Three-Phase GaN Inverter Platforms for BLDC Motor Development

EPC has introduced the EPC91128, EPC91129, EPC91130, and EPC91131 three-phase BLDC inverter platforms. Based on EPC23108–EPC23111 ePower Stage ICs, the boards support 10V to 80V operation and output currents up to 29ARMS.

EPC, EPC91128, EPC91129, EPC91130, EPC91131, EPC23108, EPC23109, EPC23110, EPC23111, GaN, eGaN, ePower Stage, BLDC Motor, Motor Drive, Three Phase Inverter, Robotics, Industrial Automation, Power Electronics

Melexis Introduces MLX92344 Hall Switch with Four Output States Over Two Wires

Melexis has introduced the MLX92344 automotive Hall switch. The device supports up to four output states over a two-wire interface, programmable current outputs from 3mA to 28mA, and operation from -40°C to +150°C.

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Toshiba Introduces 40V Automotive MOSFETs in SOP Advance(EWF) Package

Toshiba has introduced the XPMR5904PB, XPMR7404PB, and XPMR8504PB 40V automotive MOSFETs. The devices use the new SOP Advance(EWF) package, support drain currents up to 180A, and deliver lower on-resistance and thermal impedance.

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TDK DC-Link Capacitors Target High-Frequency SiC Power Systems

TDK has introduced the B25696H series of DC-link film capacitors for SiC-based power electronics. The capacitors offer voltage ratings from 900VDC to 2000VDC, capacitance up to 1280µF, self-inductance as low as 30nH, and ripple current capability up to 91A.

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