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Filtering by tag: "automotive electronics"
Clear tag filterAmbarella CV7 SoC Supports Multi-Stream 8K Edge AI Vision
Ambarella CV7 enables multi-stream 8K video processing with on-device edge AI for advanced vision systems.
Read MoreMurata ULTICIRC Substrate Targets Low Loss 6G RF Designs
Murata’s ULTICIRC LCP substrate uses an Inner Cavity design to achieve Dk below 2.0 and lower transmission loss for FR3 and 6G RF hardware.
Read MoreSTMicroelectronics NFC Chip Simplifies Matter Device Onboarding
ST’s ST25DA C enables secure tap based onboarding for Matter 1.5 devices using energy harvesting to support power free commissioning.
Read MoreSynaptics and Qualcomm Collaborate on Touch and Fingerprint Technology for AI PCs and Mobile Devices
Synaptics and Qualcomm are partnering to integrate touch and fingerprint sensing with on-device AI to improve security and user experience across mobile and AI PC platforms.
Read MoreSTMicroelectronics Launches 5MP BrightSense Image Sensors for Industrial and AI Vision
STMicroelectronics expands its BrightSense portfolio with 5 MP sensors offering dual global and rolling shutter modes, 2.25 µm pixels, RGB-IR separation, and single-frame HDR for industrial and AI vision.
Read MoreST and Tobii Bring Single-Camera Interior Sensing to Mass Production
STMicroelectronics and Tobii have entered mass production of an interior sensing system that combines RGB and IR imaging for driver and occupant monitoring.
Read MoreSilicon Labs Series 3 SoCs Bring PSA Level 4 Security and Matter-Certified Platform Support
Silicon Labs’ SixG301 family debuts with PSA Level 4 security and Matter Compliant Platform certification, enabling faster IoT product development.
Read MoreToshiba 650V SiC MOSFETs Boost Efficiency With Compact TOLL Package
Toshiba has launched 3rd generation 650V SiC MOSFETs in a compact TOLL package, cutting switching losses and improving power density for industrial and energy systems.
Read MorePanasonic Industry Brings Bluetooth 6.0 to Mass Production with PAN B611-1 Module
Panasonic Industry’s PAN B611-1 Bluetooth 6.0 module supports Channel Sounding, multi-protocol operation, and compact design for IoT and Matter applications.
Read MorePower Integrations Launches GaN Reference Kit for Solar Race Cars
Power Integrations launches a GaN-based reference kit for solar race cars, offering 95% efficiency and a heatsink-free design.
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