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Diotec PW4512 1200V 45A Rectifier For Industrial Power

Diotec PW4512 standard recovery rectifier diode offers 1200V reverse voltage, 45A average forward current, 300A surge capability, and TO-247-2L packaging for industrial power supplies, inverters, and protection stages.

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JAE DW15 Floating Connector Enables Autonomous Robot Charging

JAE DW15 Series floating connector supports autonomous charging of AGVs and AMRs with 60A at 250V DC capability, double-floating misalignment compensation, busbar contact design, and 10,000 mating cycle durability.

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Could China Dominate the RAM Market? CXMT Thinks So

China is responding to global RAM shortages with CXMT modules, leveraging RISC-V, EVs, and all-in-one PCs to meet market demand, proving that functional memory and processors can be produced even a few years behind cutting-edge technology.

China, RAM shortage, CXMT, DDR5, LPDDR5X, RISC-V, open-source processors, electric vehicles, mini PCs, consumer electronics, memory supply, semiconductor industry, PC components, global tech, AI data centers

South Korea Pushes For National Semiconductor Power Sovereignty

South Korea has launched a national task force led by Koo Sang-mo to achieve power semiconductor self-reliance by 2030, focusing on silicon carbide (SiC) and gallium nitride (GaN) technologies for EVs, power grids, AI data centers, defense, and robotics.

South Korea, power semiconductors, Koo Sang-mo, silicon carbide, SiC, gallium nitride, GaN, EVs, AI data centers, power grids, defense technology, robotics, semiconductor sovereignty, national infrastructure, energy security

Researchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives

Despite the rise of SSDs, hard disk drives remain critical for large-scale and cost-effective data storage. This article explores HDD evolution, mechanical limitations, breakthroughs like the 0.8nm MAC protective layer, and why HDDs will continue to dominate archival, cloud, and high-density storage applications.

HDD technology, hard disk drives, 0.8nm MAC layer, high-density storage, future HDD research, National University of Singapore, data center storage, cloud storage, archival storage, HDD vs SSD, HAMR technology, magnetic recording, TMR read sensors, head-to-media spacing, enterprise storage solutions, RAID storage, long-term data storage, cost-effective storage, petabyte storage, storage infrastructure, large-scale storage systems

China Moving Towards Liquid Cooling For New Datacenters

China’s rapid AI expansion is driving server power and thermal densities beyond the limits of air cooling, forcing a nationwide shift to liquid-cooled data centres. This article examines China’s semiconductor constraints, the rise of companies like Envicool and Sanhua, government initiatives, and why liquid cooling is becoming essential for next-generation high-performance computing.

China AI infrastructure, liquid-cooled servers, AI data centres China, server cooling technology, Envicool, Sanhua Intelligent Controls, Nvidia AI cooling, Intel AI data centre, Alibaba cloud infrastructure, Tencent data centres, precision cooling systems, immersion cooling, direct-to-chip cooling, high-performance computing cooling, HPC thermal management, power-dense servers, rack-scale liquid cooling, Eastern Data Western Computing initiative, PUE efficiency, AI training servers, inference server cooling, hyperscale data centres

RISC-V Process Made on Intel 3 Process – New Step in Open Source Computing

RISC-V moves closer to mainstream computing with a successful Intel 3 fabrication milestone and Linux bring-up. We examine the TC1 processor, European silicon efforts, ecosystem challenges, and what RISC-V must solve to compete with Intel, AMD, and ARM in general-purpose desktop and server platforms.

RISC-V, Intel 3, TC1 RISC-V chip, European Processor Initiative, Barcelona Supercomputing Center, open-source hardware, RISC-V processor ecosystem, Linux RISC-V support, PCIe Gen5, DDR5, heterogeneous RISC-V cores, Sargantana core, Lagarto Ka, Lagarto Ox, high performance computing, HPC processors, desktop RISC-V, server RISC-V, processor standardization, open ISA

Samsung HBM4 Ships At 11.7Gbps And 3.3TB/s Per Stack

Samsung begins mass production of HBM4 delivering 11.7Gbps per pin and up to 3.3TB/s per stack with 4nm logic base die, 2,048 I/Os, and improved power efficiency for AI datacenters.

Samsung Electronics, HBM4, high bandwidth memory, 11.7Gbps, 13Gbps headroom, 3.3TB per second, 4nm logic base die, 1c DRAM process, 12-layer stacking, 16-layer HBM, AI datacenter memory, GPU memory bandwidth, TSV technology, power distribution network optimization, HBM3E comparison, hyperscale computing

Cincon EC3AW8 EC4AW8 8:1 DC-DC Converters For 9–75V Systems

Cincon EC3AW8 and EC4AW8 3W and 6W DC-DC converters offer an 8:1 9–75V ultra-wide input range, 3000V isolation, and EN 55032 compliance for industrial and distributed power systems.

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Navitas GeneSiC 5th Gen SiC MOSFET Improves Switching Loss

Navitas 5th generation GeneSiC 1200V SiC MOSFET platform improves RDS(on) × QGD figure of merit, soft body diode behavior, and reliability for AI data centers, grid infrastructure, and industrial power conversion.

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Diotec PW4512 1200V 45A Rectifier For Industrial Power

JAE DW15 Floating Connector Enables Autonomous Robot Charging

Could China Dominate the RAM Market? CXMT Thinks So

South Korea Pushes For National Semiconductor Power Sovereignty

Researchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives

China Moving Towards Liquid Cooling For New Datacenters

RISC-V Process Made on Intel 3 Process – New Step in Open Source Computing

Samsung HBM4 Ships At 11.7Gbps And 3.3TB/s Per Stack

Cincon EC3AW8 EC4AW8 8:1 DC-DC Converters For 9–75V Systems

Navitas GeneSiC 5th Gen SiC MOSFET Improves Switching Loss

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