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u-blox Adds ZED-X20K And ZED-A20K GNSS Modules For ADAS

u-blox has introduced the ZED-X20K and ZED-A20K automotive GNSS modules for ADAS and autonomous driving, combining high-accuracy positioning, Galileo HAS support, and functional safety options.

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Panduit Expands Fiber Splice Closures For Dense FTTH Networks

Panduit has introduced new dome-style Fiber Optic Splice Closures for FTTH and broadband deployments, supporting up to 1,728 ribbon fibers with reusable gel-sealing technology.

Panduit, Fiber Optic Splice Closure, FTTH, Fiber Optics, Broadband Infrastructure, Ribbon Fiber, Outside Plant, Fiber Network, Telecommunications, PLC Splitter, Optical Fiber, Fiber Splicing, Network Infrastructure, Fiber Distribution, Underground Fiber, Aerial Fiber, Broadband Deployment, Fiber Closure, Telecom Hardware

Infineon Expands XHP 2 CoolSiC Modules For 1500V Systems

Infineon has expanded its XHP 2 CoolSiC portfolio with new 2300V SiC MOSFET modules for 1500V DC-link wind, photovoltaic, and battery storage power converters.

Infineon, CoolSiC, XHP 2, SiC MOSFET, Silicon Carbide, Power Module, High Voltage Power, 1500V DC Link, 2300V MOSFET, Renewable Energy, Wind Power, Photovoltaic Inverter, Battery Storage, Power Converter, Industrial Inverter, Energy Storage, Power Density, Thermal Interface Material, Semiconductor Losses

Malaysia Looks Towards Self-Made 3nm Chips

As Malaysia looks towards creating its own 3nm chips, the future of semiconductors in the country looks positive. But while its collaboration with ARM is certainly interesting, it’s also unusual for its choice of ARM over RISC-V. What challenges do countries like Malaysia face, what exactly is it doing with ARM, and why could RISC-V have been a better choice?

malaysia, semiconductors, 3nm chips, ARM, RISC-V, chip design, IC design, semiconductor industry, advanced manufacturing, chip fabrication, National Semiconductor Strategy, NIMP, 13th Malaysia Plan, MOSTI, GreatAsic Technology, SkyeChip, Oppstar Technology

Could Russia Jump Over EUV and Straight Into X-Ray Lithography?

With recent reports revealing that Russia may be looking to skip EUV and go straight into X-Ray lithography, many are wondering if they will achieve it, and if so, what that means for the rest of the world. What challenges do countries like Russia currently face, what has been revealed, and could we be entering the next phase of semiconductor manufacturing?

semiconductors, x-ray lithography, EUV lithography, Russia technology, chip manufacturing, semiconductor industry, microchip fabrication, nanotechnology, advanced lithography

Diodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links

Diodes Incorporated has introduced the PI6CG33A06 PCIe 7.0 clock generator with sub-30fs RMS jitter, six differential outputs, and LP-HCSL outputs for servers, HPC systems, and AI infrastructure.

Diodes Incorporated, PI6CG33A06, PCIe 7.0, PCIe Clock Generator, Clock Generator, Low Jitter Clock, AI Infrastructure, Data Center, HPC, Servers, Networking Equipment, PCI Express, LP-HCSL, HCSL, Reference Clock, Timing IC, SMBus, CK440Q, 100MHz Clock, 25MHz Clock, Semiconductor

Diodes Targets Automotive PCIe 5.0 Links With New ReDriver

Diodes Incorporated has launched the PI3EQX32904Q, a four-channel 32Gbps automotive ReDriver for PCIe 5.0, SAS4, and CXL links in smart cockpit and ADAS compute platforms.

Diodes Incorporated, PI3EQX32904Q, ReDriver, PCIe 5.0, CXL, SAS4, Automotive Electronics, Signal Integrity, ADAS, Smart Cockpit, High-Speed Interfaces, PCI Express, SiGe BiCMOS, Automotive Semiconductors, Differential Signaling, I2C, AI Computing, GPU SoC, Automotive Compute Platforms, AEC-Q100

Würth Elektronik Launches WE-SFIA Flat-Wire Inductors

Würth Elektronik has launched the WE-SFIA SMT flat-wire inductor series for automotive DC/DC converters and filter chokes, with up to 158 A saturation current, 1.0 mΩ typical DCR, and operation from -40°C to +180°C.

Würth Elektronik, WE-SFIA, Flat-Wire Inductors, SMT Inductors, Power Inductors, Automotive Electronics, DC/DC Converters, Buck Converters, Boost Converters, Multiphase Converters, Battery Management Systems, Motor Electronics, Automotive Audio, Infotainment Systems, Filter Chokes, High Current Inductors, Low DCR Inductors, Passive Components, Power Electronics, LTspice

Micron Starts Shipping 245TB 6600 ION Data Center SSD

Micron has started shipping its 245TB 6600 ION data center SSD, targeting AI infrastructure, hyperscale storage, and cloud deployments where rack density, cooling efficiency, and power constraints are becoming major operational challenges.

Micron, Micron 6600 ION, SSD, Data Center SSD, QLC NAND, AI Infrastructure, Hyperscale Storage, Enterprise Storage, E3.L, U.2 SSD, AI Data Lakes, Object Storage, Cloud Storage, Rack Density, NAND Flash, Data Center Hardware, Dell PowerEdge, Storage Infrastructure

Samtec Adds Through-Hole Options to mPOWER Connectors

Samtec has expanded its ultra micro mPOWER connector family with through-hole PCB termination options for industrial, aerospace, and military systems requiring compact high-current interconnects with improved mechanical robustness and vibration resistance.

Samtec, mPOWER, Power Connectors, Through-Hole Connectors, Board-to-Board Connectors, Wire-to-Board, Rugged Electronics, Industrial Electronics, Aerospace Electronics, Military Electronics, PCB Connectors, High Current Connectors, Embedded Systems, Power Interconnects, Connector Systems, Electronic Components, Right Angle Connectors

u-blox Adds ZED-X20K And ZED-A20K GNSS Modules For ADAS

Panduit Expands Fiber Splice Closures For Dense FTTH Networks

Infineon Expands XHP 2 CoolSiC Modules For 1500V Systems

Malaysia Looks Towards Self-Made 3nm Chips

Could Russia Jump Over EUV and Straight Into X-Ray Lithography?

Diodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links

Diodes Targets Automotive PCIe 5.0 Links With New ReDriver

Würth Elektronik Launches WE-SFIA Flat-Wire Inductors

Micron Starts Shipping 245TB 6600 ION Data Center SSD

Samtec Adds Through-Hole Options to mPOWER Connectors

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