Wakefield Thermal 133032 On-Chip Liquid Cold Plate

Introduction

The Wakefield Thermal 133032 is a high-performance on-chip liquid cold plate designed for direct CPU cooling in demanding server and computing environments. Built for Intel Eagle Stream platforms, it helps manage the substantial thermal loads generated by modern Intel Xeon Scalable processors.

Part Description

The 133032 liquid cold plate is engineered to cool 4th and 5th Generation Intel Xeon Scalable processors directly at the processor package. Its nickel-plated aluminum construction combines corrosion resistance with efficient heat transfer, while vacuum-brazed assembly supports durable, leak-resistant operation in liquid-cooling loops.

This cold plate supports processors with thermal design power ratings up to 700 W, making it suitable for dense, performance-focused computing hardware. With a thermal resistance of 0.0267°C/W, it is designed to transfer heat efficiently from the CPU into a circulating coolant system.

Key characteristics include:

• Direct liquid cooling for Intel Eagle Stream CPU platforms
• Compatibility with 4th and 5th Gen Intel Xeon Scalable processors
• Support for CPU thermal loads up to 700 W TDP
• Nickel-plated aluminum body
• Vacuum-brazed construction
• Low thermal resistance of 0.0267°C/W
• Intended for high-density server and data-center thermal management

Applications

Potential applications for the Wakefield Thermal 133032 include:

• High-performance rack servers
• Enterprise compute servers
• AI and machine-learning servers
• High-density data-center systems
• Cloud computing infrastructure
• Scientific computing clusters
• High-performance computing nodes
• Virtualization hosts
• Edge data-center servers
• Liquid-cooled workstation platforms

Industries

Industries that may use this liquid cold plate include:

• Data centers and cloud services
• Telecommunications
• Artificial intelligence
• Scientific research
• Government and defense computing
• Financial services
• Healthcare and medical imaging
• Industrial automation
• Energy and utilities
• Media rendering and digital content production

Usage Ideas

1. Liquid-Cooled AI Server Node
   Integrate the cold plate into an Intel Xeon Scalable server used for AI inference, training support, or data preprocessing workloads.

2. High-Density HPC Cluster
   Use multiple cold plates in a rack-scale liquid-cooling loop to manage processor temperatures in scientific simulation or engineering-analysis compute nodes.

3. Edge Computing Cabinet
   Build a compact, liquid-cooled edge server system for telecommunications, industrial analytics, or smart-infrastructure deployments where air cooling is limited.

Conclusion

The Wakefield Thermal 133032 On-Chip Liquid Cold Plate is a purpose-built cooling solution for Intel Eagle Stream systems using 4th and 5th Generation Intel Xeon Scalable processors. Its low thermal resistance, support for up to 700 W TDP, and vacuum-brazed nickel-plated aluminum design make it well suited for servers and computing platforms that require reliable direct liquid cooling.