Laird Technologies Tflex™ HR6.5 Thermal Gap Filler

Introduction

The Laird Technologies Tflex™ HR6.5 Thermal Gap Filler is a high-performance thermal interface material designed to enhance thermal conductivity in various applications. With its impressive thermal conductivity of over 6W/mK and robust recovery properties, this gap filler is engineered to maintain consistent thermal performance even under challenging conditions.

Part Description

The Tflex™ HR6.5 is a ceramic-filled silicone sheet that offers a thickness range from 1mm to 5mm, making it versatile for different thermal management needs. It is specifically designed to endure cyclic gap changes caused by shock, vibration, or warpage, ensuring that it provides reliable thermal performance throughout its lifespan. The material boasts a UL 94V-0 flammability rating and operates effectively within a temperature range of -50°C to +150°C. Its low outgassing and oil bleeding properties, along with good elongation, make it an ideal choice for sensitive electronic components.

Applications

• Base stations
• Power amplifiers
• Active antenna units
• Automotive infotainment systems
• Automotive electronics
• Instrumentation
• Test and measurement devices
• Computer servers
• Notebooks
• Tablets
• Portable devices

Industries

• Telecommunications
• Automotive
• Consumer Electronics
• Industrial Equipment
• Aerospace
• Medical Devices

Usage Ideas

1. Automotive Electronics Cooling: Utilize the Tflex™ HR6.5 to manage heat dissipation in automotive infotainment systems, ensuring optimal performance and longevity of electronic components.

2. Server Thermal Management: Implement the gap filler in computer servers to enhance thermal conductivity between heat-generating components and heat sinks, improving overall system efficiency.

3. Portable Device Assembly: Use the Tflex™ HR6.5 in the assembly of tablets and notebooks to ensure effective thermal management, enhancing user experience by preventing overheating during prolonged use.

Conclusion

The Laird Technologies Tflex™ HR6.5 Thermal Gap Filler is an essential component for effective thermal management in a wide range of applications. Its high thermal conductivity, resilience, and versatility make it suitable for various industries, from automotive to consumer electronics. By integrating this thermal interface material into your projects, you can ensure reliable performance and longevity of your electronic devices.