Stackable µPOL Module


Stackable µPOL Module

Manufacturer

Part #

Category

TDK Corporation FS1525 Power

Description

The FS1525 is a compact point-of-load (PoL) converter that delivers up to 25 A and can be stacked to provide a combined output of 200 A. Designed for AI servers and data center systems, it features ultra-fast transient response and low DC ripple. Its advanced 3D architecture integrates all critical components, optimizing thermal performance and board space efficiency.

Stackable µPOL Module FS1525: A Power Solution for Modern Computing

Introduction

The FS1525 is a cutting-edge stackable µPOL (micro Point-of-Load) module developed by TDK Corporation. This compact DC-DC converter is designed to deliver high current outputs, making it an ideal choice for advanced computing applications, particularly in AI servers and data centers.

Part Description

The FS1525 is a non-isolated DC-DC converter that provides up to 25 A of output current per module, with the capability to stack multiple units to achieve a combined output of 200 A. Its innovative 3D architecture integrates essential components such as MOSFETs, inductors, and control circuitry into a single compact package measuring just 7.65 x 6.80 mm. This design not only optimizes thermal performance but also enhances board space efficiency. The module supports input voltages ranging from 4.5 V to 16 V and offers an adjustable output voltage from 0.6 V to 1.8 V, making it suitable for powering modern low-voltage AI processors and other high-performance computing components.

Applications

  • AI and edge computing
  • Telecom and networking applications
  • Data center computing
  • Optical networks
  • Medical imaging
  • Powering AI chipsets, ASICs, FPGAs, and SoCs

Industries

  • Information Technology
  • Telecommunications
  • Healthcare
  • Automotive
  • Aerospace
  • Industrial Automation

Usage Ideas

  1. AI Server Development: Utilize the FS1525 to create a high-density power solution for an AI server, ensuring efficient power delivery to multiple AI processors.
  2. Telecom Equipment: Design a telecom networking device that leverages the stackable capability of the FS1525 to provide reliable power to various components in a compact form factor.
  3. Medical Imaging Systems: Implement the FS1525 in a medical imaging device, ensuring low ripple and fast transient response for sensitive imaging applications.

Conclusion

The FS1525 stackable µPOL module from TDK Corporation represents a significant advancement in power management technology. Its ability to deliver high current outputs in a compact design makes it an excellent choice for a variety of demanding applications in modern computing and beyond. With its advanced features and flexibility, the FS1525 is poised to drive the future of intelligent computing solutions.