Laird Technologies Tflex™ HR6.5 Thermal Gap Filler

Introduction

The Laird Technologies Tflex™ HR6.5 Thermal Gap Filler is a high-performance thermal interface material designed to enhance thermal conductivity in various applications. With its impressive thermal conductivity rating of over 6W/m-K and robust recovery properties, this filler is ideal for environments subject to mechanical stress and temperature fluctuations.

Part Description

The Tflex™ HR6.5 is engineered to provide consistent thermal performance while accommodating cyclic gap changes caused by shock, vibration, or warpage. It features a thickness range of 1mm to 5mm, making it versatile for different applications. The material is a ceramic-filled silicone sheet that is UL 94V-0 rated for flammability, ensuring safety in various operating conditions. It operates effectively within a temperature range of -50°C to +150°C, making it suitable for demanding environments. The filler is designed to minimize stress on components, is easy to assemble, and can often be reused after rework due to its excellent rebound capability.

Applications

• Base stations
• Power amplifiers
• Active antenna units
• Automotive infotainment systems
• Automotive electronics
• Instrumentation
• Test and measurement devices
• Computer servers
• Notebooks and tablets
• Portable electronic devices

Industries

• Telecommunications
• Automotive
• Consumer Electronics
• Industrial Equipment
• Aerospace
• Medical Devices

Usage Ideas

1. Thermal Management in Automotive Electronics: Use the Tflex™ HR6.5 to improve heat dissipation in automotive infotainment systems, ensuring optimal performance and longevity.
2. Cooling Solutions for Computer Servers: Implement the thermal gap filler in server racks to enhance thermal conductivity between components, reducing overheating risks.
3. Thermal Interface for Portable Devices: Integrate the filler in tablets and notebooks to maintain efficient thermal management, enhancing user experience during prolonged use.

Conclusion

The Laird Technologies Tflex™ HR6.5 Thermal Gap Filler stands out as a reliable solution for thermal management across various applications and industries. Its high thermal conductivity, resilience, and ease of use make it an essential component for ensuring optimal performance in electronic devices subjected to thermal and mechanical stress. Whether in telecommunications, automotive, or consumer electronics, the Tflex™ HR6.5 is designed to meet the demanding needs of modern technology.