Latest Components
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ams OSRAM GW PUBRA1.HW OptoelectronicsDescription
ams OSRAM OSCONIQ™ P 3737 Batwing LEDs deliver unmatched efficiency and versatility for modern horticulture. These LEDs provide wide-angle coverage with reduced hotspots, making them ideal for large-area horticultural lighting. Their innovative lens options ensure superior energy conversion and uniform light distribution, enhancing plant growth.
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Infineon Technologies IM66D132HV01 / IM68D121JV01 SensorsDescription
Infineon Technologies Ultra-low Power Digital PDM XENSIV™ MEMS Microphones are designed for applications requiring long battery life and environmental robustness in a compact form. They feature a Signal-to-Noise Ratio (SNR) of 66.5dB(A) and 68dB(A), with a low corner frequency of 20Hz. These microphones are ideal for smartphones, mobile devices, and high-quality audio capturing.
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Displaytech DT035CTFT OptoelectronicsDescription
Displaytech DT035CTFT 3.5" IPS LCD Modules offer a wide form factor with a resolution of 320 x 480 pixels. These modules include an LCD panel, display drivers, and an adjustable LED backlight unit, with an additional capacitive touch panel in the DT035CTFT-IPS-SHB-PTS model. They are suitable for industrial, consumer, and medical devices, operating within a temperature range of -20°C to 70°C.
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Infineon Technologies REF_5GR4780AG-1_6W1 PowerDescription
The Infineon Technologies REF_5GR4780AG-1_6W1 Reference Board is a 6W (12V, 500mA) reference board designed for offline Switch Mode Power Supplies (SMPS). It features an isolated flyback converter topology and integrates an 800V CoolMOS™ MOSFET IC along with a PWM controller for enhanced efficiency. This board is ideal for applications in auxiliary power supplies for various electronic devices.
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Infineon Technologies XENSIV-PASCO2V15 SensorsDescription
The XENSIV™ PASCO2V15 Connected Sensor Kit is a feather-compatible development kit designed for rapid prototyping of IoT devices. It includes highly accurate XENSIV™ sensors, a low-power dual-core microcontroller, and a combo radio module for Bluetooth and Wi-Fi connectivity. This kit is ideal for battery-powered applications in smart homes and buildings.
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NXP Semiconductors i.MX RT1180 SemiconductorsDescription
The NXP i.MX RT1180 Crossover Microcontrollers feature a high-performance Arm Cortex-M7 core operating at speeds up to 800MHz and a power-efficient Cortex-M33 core up to 300MHz. Designed for industrial automation and IoT applications, they support various real-time protocols and include advanced security features. With integrated power management and a large on-chip RAM, these MCUs simplify complex system designs.
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HellermannTyton 147976963 ConnectorsDescription
HellermannTyton Solar Ratchet O-Clamp features a custom design clip that attaches easily to ATI torque tubes, offering one-handed, tool-less simplicity. This O-clamp offers size versatility, making it capable of managing wires and cables on solar modules. With one-piece, adjustable construction, this O-clamp can be closed by hand to the desired diameter.
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Nexperia NCA6416 SemiconductorsDescription
Nexperia NCA6416 Low-Voltage 16-Bit I/O Expanders are designed for microcontrollers needing additional I/O pins. They utilize an I²C-bus interface, making them suitable for compact applications like battery-powered devices with sensors and LED control. The device features multiple registers for configuration, input, output, and polarity inversion.
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Silvertel EvalAg59800-LPB PowerDescription
Silvertel EvalAg59800-LPB Evaluation Boards are fitted with an Ag59812-LPB or Ag59824-LPB miniaturized Class 8 surface-mount PoE module. These boards are designed to evaluate Silvertel's Ag598000-LPB open-frame Power over Ethernet (PoE) modules. They ensure the passing of Ethernet data signals from the Midspan PSE- or PoE-enabled switch to the connected system.
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Laird Technologies Tflex HR6.5 PassivesDescription
Laird Technologies Tflex™ HR6.5 Thermal Gap Filler is a thermal interface material with >6W/mK thermal conductivity and high recovery properties. This filler is designed to withstand cyclic gap changes due to shock, vibration, or warpage, ensuring consistent thermal performance. It offers a thickness range of 1mm to 5mm and is suitable for various applications including automotive electronics and computer servers.
