TDK has introduced the FS3303, a micro point-of-load power module for small, low-voltage rails in optical networking equipment and AI edge hardware. The part is the first device in a wider micro POL expansion from TDK, aimed at boards where the power converters now have to sit close to ASICs, SoCs, DSPs, and AI devices without taking up much height or routing space.
The FS3303 is a non-isolated DC-DC module used to generate regulated local supply rails from a 2.7 V to 6 V input. It measures 2.5 mm × 2.5 mm with a 1.2 mm height, yet can supply up to 3 A while reaching peak efficiency of around 95%.
For compact optical modules and edge AI boards, the useful part is the amount of power circuitry TDK has pulled into the package. There often isn’t room to keep adding separate controllers, MOSFETs, inductors, and support parts every time another low-voltage rail is needed.
Small POL Module for Low-Voltage AI Rails
The FS3303 supports output voltages from 0.4 V to 3.3 V, which puts it in the range used by many digital ICs and mixed-signal devices inside compact compute and networking hardware. TDK is positioning the part for optical modules, AI chipsets, ASICs, SoCs, and DSPs. These are usually boards where the converter has to live close to the load, but the area around the load is already crowded with memory, high-speed traces, shielding, connectors, and thermal paths.
That makes the physical converter package just as important as the electrical rating. A 3 A rail is not unusual by itself, but putting that rail into a 2.5 mm square package with the inductor already included changes how much space is left around the rest of the design.
Optical modules are a good example. TDK notes that these systems are moving from 10 Gbit/s toward 1.6 Tbit/s, while the available board and module space remains tightly controlled.
3D Embedded Package Includes the Inductor
The FS3303 uses TDK’s 3D chip-embedded packaging technology. The controller, driver, MOSFETs, and power inductor are built into the module, reducing the number of external parts needed around the converter. That can help with routing around dense devices, since the high-current switching loop is contained inside a very small physical area. It also reduces the height penalty that normally comes with placing a separate inductor on the board.
For optical transceivers and small edge AI modules, height can be just as limiting as board area. Cages, shielding, airflow gaps, and enclosure geometry can leave very little vertical clearance above the PCB. The FS3303 is rated for operation at ambient temperatures up to +90 °C, with use up to +125 °C under derated conditions.
Wider Micro POL Range Extends to 80 A
TDK says the FS3303 is the first device in a broader micro POL lineup covering output currents from 3 A to 80 A across 0.3 V to 3.3 V rails. The larger family will target height profiles from 1.2 mm to 1.7 mm, keeping the focus on dense power delivery rather than conventional point-of-load module footprints.
That range points toward larger AI accelerator and optical networking boards where several local rails may be needed across processors, SerDes devices, memory, and support logic.
The FS3303-0400-AL is now in full production and is sampling through major distributors.
Learn more and read the original announcement at www.tdk.com
Technology Overview
The TDK FS3303 is a non-isolated micro point-of-load DC-DC power module for compact AI edge and optical networking systems. It supports a 2.7 V to 6 V input range, 0.4 V to 3.3 V output rails, and up to 3 A output current in a 2.5 mm × 2.5 mm × 1.2 mm package. The module uses TDK’s 3D chip-embedded packaging to integrate the controller, driver, MOSFETs, and inductor.
Frequently Asked Questions
What is the TDK FS3303 used for?
The FS3303 is used to generate local low-voltage power rails for compact systems such as optical modules, AI edge boards, ASICs, SoCs, DSPs, and AI chipsets.
What output current does the FS3303 support?
The FS3303 supports up to 3 A output current.
What makes the FS3303 package different?
The FS3303 integrates the controller, driver, MOSFETs, and power inductor into a 2.5 mm × 2.5 mm × 1.2 mm package using TDK’s 3D chip-embedded packaging technology.
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