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Renesas Introduces Gen 3 DDR5 MRDIMM Chipset with 16,000 MT/s Performance

Renesas has introduced its Gen 3 DDR5 MRDIMM chipset, delivering up to 16,000 MT/s memory performance while maintaining compatibility with existing DDR5 server infrastructure.

Renesas, DDR5, MRDIMM, Memory, Server Memory, MRCD, MDB, DRAM, HPC, AI Servers, Data Centre, PMIC, SPD Hub, Memory Interface, Electronic Components

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.

SK hynix, iHBM, HBM, HBM5, AI memory, high bandwidth memory, thermal management, AI accelerator, GPU memory, HPC, data center, semiconductor packaging, MR-MUF, wafer level packaging, memory cooling, D2D PHY, AI infrastructure, advanced packaging, memory technology

Diodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links

Diodes Incorporated has introduced the PI6CG33A06 PCIe 7.0 clock generator with sub-30fs RMS jitter, six differential outputs, and LP-HCSL outputs for servers, HPC systems, and AI infrastructure.

Diodes Incorporated, PI6CG33A06, PCIe 7.0, PCIe Clock Generator, Clock Generator, Low Jitter Clock, AI Infrastructure, Data Center, HPC, Servers, Networking Equipment, PCI Express, LP-HCSL, HCSL, Reference Clock, Timing IC, SMBus, CK440Q, 100MHz Clock, 25MHz Clock, Semiconductor

Broadcom Ships Tomahawk Ultra: A New Benchmark for Ethernet in AI and HPC

Broadcom's Tomahawk Ultra delivers 250ns latency, lossless Ethernet, and in-network collectives for scale-up AI and HPC systems.

Broadcom, Tomahawk Ultra, Ethernet Switch, AI Infrastructure, HPC, Low Latency, Lossless Networking, In Network Compute, Data Center, SUE, SUE Lite, Link Layer Retry, Edge AI, Semiconductor, Networking Hardware, High Performance Computing

Inside Intel’s Aurora: Engineering the Exascale Era

Intel’s Aurora Supercomputer at Argonne delivers exaflop performance, enabling breakthroughs in AI, physics, and scientific computing.

Intel, Aurora, Supercomputing, Exascale, High Performance Computing, HPC, AI Infrastructure, oneAPI, DAOS, Argonne National Laboratory, Data Center, Scientific Computing, Large Language Models, Semiconductor, Accelerators

Renesas Introduces Gen 3 DDR5 MRDIMM Chipset with 16,000 MT/s Performance

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

Diodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links

Broadcom Ships Tomahawk Ultra: A New Benchmark for Ethernet in AI and HPC

Inside Intel’s Aurora: Engineering the Exascale Era

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