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STMicroelectronics Scales Silicon Photonics for AI Interconnects

STMicroelectronics moves its PIC100 silicon photonics platform into high-volume 300 mm production for 800G and 1.6T optical interconnects supporting AI data center infrastructure.

STMicroelectronics, PIC100, silicon photonics, optical interconnect, AI infrastructure, hyperscale data centers, optical transceivers, 800G optics, 1.6T optics, photonic integrated circuits, silicon nitride waveguides, optical modulators, co packaged optics, near packaged optics, data center networking

Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.

Molex, Impress Co-Packaged Copper, co-packaged optics, co-packaged copper, 224G PAM-4, near ASIC connectivity, high-speed interconnect, data center networking, AI accelerators, hyperscale architecture, substrate connector, compression connector, SerDes, 3.2T networking, signal integrity, PCB loss reduction, high-density server design

STMicroelectronics Scales Silicon Photonics for AI Interconnects

Molex Impress Moves 224G Links Onto the ASIC Substrate

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