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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Researchers Develop World’s First Probabilistic Bit on Regular CMOS Process

Making quantum computing components in a lab is one thing, but getting them to work using standard CMOS processes is another. Now, a team of researchers have successfully demonstrated the production of p-bits using standard CMOS technology. What challenges does the manufacture of quantum systems involve, what did the researchers develop, and how does this change the quantum game?

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Planar Vacuum Tubes Could Replace Transistors

Vacuum tubes were phased out decades ago in favour of silicon transistors. But recently, researchers demonstrates planar vacuum devices which could very well replace transistors due to their superior performance. What challenges did tubes face, what did the researchers develop, and why could they potentiall replace transistors in the future?

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ST Vibration Sensor Adds In-Sensor AI for Condition Monitoring

STMicroelectronics has introduced the IIS3DWB10IS, a MEMS vibration sensor for industrial condition monitoring. The device combines 200g vibration measurement, bandwidth above 10kHz, ISPU 2.0 processing, embedded AI inference, and operation up to 125°C in a compact LGA package.

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Toshiba Adds Complementary Dual MOSFET For Motor Control And Load Switching

Toshiba has introduced the SSM6L826R, a 30 V complementary dual MOSFET that combines N-channel and P-channel devices in a TSOP6F package for motor control and load-switching applications in consumer and industrial equipment.

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EPC Demonstrates 800 V To 12.5 V AI Power Converter Without 48 V Stage

EPC's EPC91123 evaluation board converts 800 VDC directly to 12.5 VDC at up to 6 kW, achieving 98.2% efficiency while eliminating the need for a 48 V intermediate stage.

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Huawei Unveils Plans for 1.4nm Devices

As the US continues to try and limit China’s technological capabilities, Huawei has recently revealed their plans to achieve 1.4nm chips, something that would negate all US efforts. What challenges does China face in creating smaller transistors, what did Huawei announce, and why could this be the end of US capabilities in limiting Chinese engineers?

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Researchers Stack Active Chip Layers To Increase Transistor Count

As researchers approach the fundamental limits of transistor design, some are now looking to go up rather than down. What challenges does chip stacking face, what have researchers recently demonstrated, and why is this the future of semiconductor technologies?

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Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Infineon has introduced the FS01M9R13A7MA2B, a 1300 V HybridPACK Drive silicon carbide power module supporting continuous 205°C operation and up to 15% higher output current for EV traction inverters.

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Diodes Combines USB PD3.1 And Buck Control In Automotive USB-C IC

Diodes has introduced the APK43070Q, an automotive-qualified USB PD3.1 controller with integrated buck conversion, 140 W charging support, and intelligent power sharing across up to eight USB-C ports.

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Qorvo Expands RF Switching Portfolio With Wideband 10 GHz Family

Qorvo has introduced the QPC6144, QPC6122, and QPC6188 RF switches, delivering wideband operation from 50 MHz to 10 GHz with high isolation and simplified RF routing for 5G, industrial, drone, and test systems.

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