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Alpha and Omega Semiconductor MOSFETs Target AI Server Power Density

Alpha and Omega Semiconductor has introduced the AONC40202 and AONC68816 MOSFETs in DFN 3.3 x 3.3 double-sided cooling source-down packages for AI server Intermediate Bus Converter applications.

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Microchip Power Module Lifts AI Server Density With Vertical Architecture

Microchip’s MCPF1525 power module provides 25A per device, stackable to 200A, with PMBus control, low noise performance and a vertical package that improves board density for AI, HPC and PCIe based compute systems.

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EPC’s First Gen 7 eGaN FET Pushes Power Density in 40 V Designs

EPC’s new 40 V Gen 7 eGaN transistor offers low RDS(on) and reduced switching loss for compact, high efficiency power stages.

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