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Melexis MLX91299 RC Snubber Boosts SiC Module Reliability

Silicon RC snubber reduces SiC switching losses and stabilises high-voltage modules for automotive and industrial designs.

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Nexperia 100 V CCPAK1212 MOSFETs Target 48 V Automotive Power Systems

Nexperia’s CCPAK1212 MOSFETs combine 0.99 mΩ RDS(on), 460 A current capability, and copper-clip packaging to shrink PCB space and boost efficiency.

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ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

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Researchers Create New Gallium Oxide Semiconductor With Superior Current Capabilities

Researchers at Nagoya University have developed stable p-type gallium oxide (Ga₂O₃) diodes capable of handling twice the current of previous devices, addressing a key limitation that held the material back. Could this breakthrough make Ga₂O₃ a practical alternative to GaN, and what applications will benefit most from its improved efficiency?

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Murata Expands Isolated DC-DC Converters for PoE Devices

Murata introduces compact isolated DC-DC converters for IEEE 802.3af PoE systems, delivering efficient 5 V power in space-constrained devices such as cameras and biometric units.

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Samsung Electro-Mechanics Introduces 100 nF 0805 MLCC for Hybrid Inverters

Samsung Electro-Mechanics releases an 0805 MLCC rated 250 V, 100 nF (X7T), AEC-Q200 qualified for hybrid and mild hybrid vehicle inverter snubber circuits.

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Toshiba Shrinks Automotive Photorelay for High-Voltage Battery Systems

Toshiba’s TLX9161T photorelay offers 1500V withstand voltage in a smaller SO12L-T package, helping engineers design safer, more compact EV battery systems.

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Tata Elxsi Partners with Infineon to Drive India’s EV Innovation

Tata Elxsi and Infineon Technologies have partnered to co-develop electric vehicle systems for India, including inverters, battery management, and onboard chargers. The collaboration blends system design with advanced semiconductors like SiC devices and supports ISO 26262 safety standards. Aimed at accelerating India’s fast-growing EV market, the partnership also targets future sectors like eVTOL and off-highway electric vehicles with cost-efficient, production-ready platform solutions.

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EPC’s GaN Integration Brings New Agility to Robotic Motion

EPC’s EPC91120 reference design combines GaN power, sensing, and control in a 32 mm module, improving efficiency and responsiveness in robot joints and UAVs.

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Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.

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