Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
TDK Launches Industry’s Highest-Capacitance 100 V MLCC in 1608 Size
TDK launches a 1 µF, 100 V MLCC in 1608 size, the industry’s highest capacitance for this spec, supporting BOM reduction in 48 V and industrial systems.
Read MoreROHM SiC MOSFETs Power Toyota’s New bZ5 BEV in Chinese Market
ROHM’s SiC MOSFETs power Toyota’s new bZ5 BEV in China, boosting inverter efficiency and range through HAIMOSIC’s high-volume production.
Read MoreMicrochip Expands TrustMANAGER Platform to Meet New Cybersecurity Regulations
Microchip enhances TrustMANAGER with secure FOTA and remote key management to meet EU Cyber Resilience Act and RED compliance for connected devices.
Read MoreEPC Space Launches Industry-Leading 300 V Rad‑Hard GaN FET for Satellite Power Systems
EPC Space launches a 300 V radiation‑hardened GaN FET with top-tier current handling and efficiency for high-voltage satellite power systems.
Read MoreSamtec Introduces Bulls Eye® ISI Evaluation Boards for Simplified SerDes Testing
Samtec’s new Bulls Eye ISI Evaluation Boards support 70 GHz and 90 GHz SerDes testing, streamlining multi-lane validation across PAM4 and PAM6 designs.
Read MoreVishay AEC-Q200 Chip Resistors Perform to 70 GHz
Vishay’s CHA series thin film chip resistors deliver stable 70 GHz performance for automotive, aerospace, and RF applications.
Read MoreEPC 180 W GaN Buck Converter Evaluation Board for USB Power Delivery Applications
EPC has launched the EPC91109, a 180 W GaN-based buck converter evaluation board for USB-PD 3.1 applications. Featuring EPC2057 GaN FETs and the LTC7890 controller, it delivers up to 14.3 A with over 98% efficiency—all in a compact 24 mm x 24 mm footprint without a heatsink or airflow. Ideal for laptops and portable systems, the board demonstrates GaN’s potential to replace silicon in high-power, space-constrained designs.
Read MoreTE Connectivity Launches Modular MULTIGIG TRX Platform for Rugged Fibre Optic Applications
TE Connectivity has launched its MULTIGIG TRX platform, a modular fibre optic transceiver system for aerospace, defence, and marine markets. Featuring up to 12 hot-swappable 10 Gbps transceivers, it enables faster data, simplified upgrades, and minimal downtime. Qualified to standards like DO-160G and MIL-STD-883, the platform offers high-speed connectivity in rugged environments and supports future expansion without reworking the PCB or replacing the full module.
Read MoreTata Elxsi Partners with Infineon to Drive India’s EV Innovation
Tata Elxsi and Infineon Technologies have partnered to co-develop electric vehicle systems for India, including inverters, battery management, and onboard chargers. The collaboration blends system design with advanced semiconductors like SiC devices and supports ISO 26262 safety standards. Aimed at accelerating India’s fast-growing EV market, the partnership also targets future sectors like eVTOL and off-highway electric vehicles with cost-efficient, production-ready platform solutions.
Read MoreTDK Acquires SoftEye: AI Vision Tech Joins the TDK Ecosystem
TDK has acquired an AI startup focused on eye-intent human-machine interface (HMI) technology, advancing its edge AI and embedded systems strategy. The startup’s eye-tracking platform enables intuitive, hands-free control for automotive, medical, and consumer electronics. This move strengthens TDK’s position in next-generation HMI, sensor innovation, and natural user interfaces designed to improve how humans interact with machines.
Read More