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Filtering by tag: "thermal design"

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Bourns Announces High-Heat Thick Film Resistor Series

Bourns unveils the PF2270 resistor series in a compact TO-227 package, supporting up to 300W power dissipation and high-temperature operation.

Bourns, resistors, thick film, power electronics, energy storage, battery systems, industrial, motor drives, thermal design, high power, TO 227, components

EPC 180 W GaN Buck Converter Evaluation Board for USB Power Delivery Applications

EPC has launched the EPC91109, a 180 W GaN-based buck converter evaluation board for USB-PD 3.1 applications. Featuring EPC2057 GaN FETs and the LTC7890 controller, it delivers up to 14.3 A with over 98% efficiency—all in a compact 24 mm x 24 mm footprint without a heatsink or airflow. Ideal for laptops and portable systems, the board demonstrates GaN’s potential to replace silicon in high-power, space-constrained designs.

GaN, USB Power Delivery, 180W converter, buck converter, compact power design, portable electronics, eGaN, EPC2057, high efficiency power supply, thermal design, synchronous buck converter, power density, Analog Devices LTC7890, reference board, power FETs

Bourns Announces High-Heat Thick Film Resistor Series

EPC 180 W GaN Buck Converter Evaluation Board for USB Power Delivery Applications

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