Latest Components
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Nordic Semiconductor nRF5340 Audio DK SemiconductorsDescription
The nRF5340 Audio DK is a development kit designed for Bluetooth LE Audio applications, featuring the nRF5340 SoC and Cirrus Logic CS47L63 audio DSP. It supports multiple configurations including USB dongle, headset, and broadcast receiver, and includes user-programmable buttons, LEDs, and SD-Card storage. Ideal for prototyping earbuds, headphones, and other wireless audio solutions.
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STMicroelectronics STDRIVEG600 SemiconductorsDescription
The STDRIVEG600 is a high-speed half-bridge gate driver designed for enhancement mode GaN FETs and N-channel power MOSFETs. It supports high-side voltages up to 600V, features UVLO protection, and offers fast propagation delay for efficient switching. The device is ideal for driving high-voltage, high-speed power transistors in demanding applications.
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Renesas RZ/G2L SemiconductorsDescription
The Renesas RZ/G2L MPU Series features dual-core Arm Cortex-A55 CPUs, a 3D graphics engine, and a video codec engine, all integrated into a single chip. Designed for HMI equipment, it supports advanced AI processing and reduces system BOM cost by integrating real-time sub-MCUs and ADCs. It is ideal for industrial HMI, intercoms, POS terminals, home appliances, and security cameras.
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Nexperia PSMN1R2-55SLH SemiconductorsDescription
These 50 V and 55 V ASFETs are optimized for 36 V DC motor control, offering high current capability, enhanced Safe Operating Area, and excellent avalanche ruggedness. Designed for demanding applications such as cordless power tools, e-bikes, and battery protection, they provide high efficiency and board-level reliability. The LFPAK88 package enables direct switching from a 5 V gate drive and supports high load and stall currents.
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Renesas RZ/V2L SemiconductorsDescription
The Renesas RZ/V2L MPU Series is a general-purpose microprocessor unit featuring a dual-core Arm Cortex-A55 CPU, integrated AI accelerator (DRP-AI), 3D graphics, and video codec engine. It is designed for energy-efficient edge AI and vision applications, offering high performance with low power consumption. The RZ/V2L is pin-compatible with the RZ/G2L series, enabling flexible system design.
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NXP i.MX 8M Nano Family SemiconductorsDescription
The NXP i.MX 8M Nano Family features up to 4x Arm Cortex-A53 cores and 1x Cortex-M7 core, offering cost-effective integration and performance for smart, connected, and power-efficient devices. It is suitable for applications requiring graphics, vision, voice control, and intelligent sensing. The family is pin-compatible with i.MX 8M Mini processors and designed for industrial and IoT use.
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NXP TJA146x SemiconductorsDescription
The NXP TJA146x series are advanced CAN transceivers designed to improve signal integrity in large and high-speed networks. They reduce signal ringing and enable robust communication even with lower specification cabling. The series supports accelerated bit rates beyond 5 or even 8 Mbps for demanding automotive and industrial applications.
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NXP TJA115x SemiconductorsDescription
The NXP Secure TJA115x CAN/CAN FD transceiver family provides hardware-based authentication and flooding protection for classical CAN and CAN FD communication. It offers a cost-effective solution for securing local CAN networks without cryptography. Integrated filtering ensures robust protection against denial-of-service attacks.
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NXP S32K3 SemiconductorsDescription
The NXP S32K3 Family are 32-bit Arm Cortex-M7-based microcontrollers designed for automotive applications, offering high performance, scalability, and functional safety up to ISO 26262 ASIL D. They feature advanced security, FOTA support, and a wide range of connectivity options. Available in multiple package types, these MCUs are ideal for body, zone control, and electrification applications.
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NXP LPC55S6x SemiconductorsDescription
The LPC55S6x MCU family features high-efficiency Arm Cortex-M33 cores, advanced security with TrustZone-M, and a proprietary DSP accelerator for enhanced signal processing. It offers flexible performance and power efficiency options, scalable packages, and robust software support. Ideal for edge computing and secure embedded applications.
