Infineon has introduced the TDA235E5 and TDA235E0 dual-phase smart power stages for power delivery to AI accelerators and server processors, delivering more than 2 A/mm² from a 6 × 6 × 0.8 mm package.
The new devices integrate Infineon's OptiMOS 6 MOSFETs and a dual-phase driver IC, supporting up to 300 A peak current and 120 A total design current (TDC). Both lateral and vertical power delivery configurations are supported, allowing the power stages to be used with conventional server designs as well as emerging vertical power architectures.
Infineon is targeting the TDA235E5 and TDA235E0 at high-current AI xPU accelerators and conventional server CPUs, where increasing processor power requirements are placing greater demands on the final stages of the power delivery network.
300 A Peak Current from a 6 × 6 mm Package
Integrating two phases into a single 6 × 6 mm package gives the TDA235E5 and TDA235E0 a power density exceeding 2 A/mm². The package is also 0.8 mm high, making the devices suitable for power delivery designs where the available area and height around the processor are limited.
Each device supports up to 300 A peak current and 120 A TDC. The integrated OptiMOS 6 power MOSFETs and dual-phase driver bring the switching devices and drive circuitry into the same package rather than implementing the two phases as separate power stages.
The devices can be paired with Infineon's digital multiphase controllers, allowing multiple power stages to be used across the processor's different power rails.
Support for Vertical Power Delivery
The TDA235E5 and TDA235E0 support both lateral and vertical power delivery configurations. In a conventional lateral architecture, power is delivered to the processor from conversion circuitry positioned around it on the board. Vertical power delivery places the final conversion stage beneath or closer to the processor package, shortening the path between the power stage and processor.
That becomes increasingly relevant as AI accelerators operate at low core voltages while drawing very high currents. Infineon has designed the new family for both approaches, allowing the same power-stage technology to be used as server architectures move towards vertical power modules.
The 0.8 mm package height is particularly relevant to these space-constrained vertical configurations.
Thermal Design for High-Current Processors
Infineon has also focused on the thermal path from the junction to the top of the package. The TDA235E5 and TDA235E0 have low junction-to-top-side thermal impedance, supporting integration with liquid cooling systems used around high-power AI processors.
The combination of high current capability, compact packaging and support for vertical power delivery targets the final conversion stages supplying AI accelerators and server CPUs, where power needs to be delivered close to the processor while managing the heat generated by the power electronics.
Engineering samples of the TDA235E5 and TDA235E0 are available now for customer evaluation.
Learn more and read the original announcement at infineon.com.
Technology Overview
The Infineon TDA235E5 and TDA235E0 are dual-phase smart power stages for AI accelerators and server processors. They integrate OptiMOS 6 MOSFETs and a dual-phase driver in a 6 × 6 × 0.8 mm package, supporting up to 300 A peak current and both lateral and vertical power delivery.
FAQs
What are the Infineon TDA235E5 and TDA235E0?
They are dual-phase smart power stages designed to supply high-current AI accelerators and server CPUs.
How much current do the TDA235E5 and TDA235E0 support?
The devices support up to 300 A peak current and 120 A total design current, with power density exceeding 2 A/mm².
Do the TDA235E5 and TDA235E0 support vertical power delivery?
Yes. Both lateral and vertical power delivery configurations are supported, allowing the devices to be used in conventional server designs and emerging vertical power module architectures.
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