Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Could China Dominate the RAM Market? CXMT Thinks So
China is responding to global RAM shortages with CXMT modules, leveraging RISC-V, EVs, and all-in-one PCs to meet market demand, proving that functional memory and processors can be produced even a few years behind cutting-edge technology.
Read MoreSouth Korea Pushes For National Semiconductor Power Sovereignty
South Korea has launched a national task force led by Koo Sang-mo to achieve power semiconductor self-reliance by 2030, focusing on silicon carbide (SiC) and gallium nitride (GaN) technologies for EVs, power grids, AI data centers, defense, and robotics.
Read MoreResearchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives
Despite the rise of SSDs, hard disk drives remain critical for large-scale and cost-effective data storage. This article explores HDD evolution, mechanical limitations, breakthroughs like the 0.8nm MAC protective layer, and why HDDs will continue to dominate archival, cloud, and high-density storage applications.
Read MoreChina Moving Towards Liquid Cooling For New Datacenters
China’s rapid AI expansion is driving server power and thermal densities beyond the limits of air cooling, forcing a nationwide shift to liquid-cooled data centres. This article examines China’s semiconductor constraints, the rise of companies like Envicool and Sanhua, government initiatives, and why liquid cooling is becoming essential for next-generation high-performance computing.
Read MoreRISC-V Process Made on Intel 3 Process – New Step in Open Source Computing
RISC-V moves closer to mainstream computing with a successful Intel 3 fabrication milestone and Linux bring-up. We examine the TC1 processor, European silicon efforts, ecosystem challenges, and what RISC-V must solve to compete with Intel, AMD, and ARM in general-purpose desktop and server platforms.
Read MoreSamsung HBM4 Ships At 11.7Gbps And 3.3TB/s Per Stack
Samsung begins mass production of HBM4 delivering 11.7Gbps per pin and up to 3.3TB/s per stack with 4nm logic base die, 2,048 I/Os, and improved power efficiency for AI datacenters.
Read MoreCincon EC3AW8 EC4AW8 8:1 DC-DC Converters For 9–75V Systems
Cincon EC3AW8 and EC4AW8 3W and 6W DC-DC converters offer an 8:1 9–75V ultra-wide input range, 3000V isolation, and EN 55032 compliance for industrial and distributed power systems.
Read MoreNavitas GeneSiC 5th Gen SiC MOSFET Improves Switching Loss
Navitas 5th generation GeneSiC 1200V SiC MOSFET platform improves RDS(on) × QGD figure of merit, soft body diode behavior, and reliability for AI data centers, grid infrastructure, and industrial power conversion.
Read MoreAllegro MicroSystems ACS37017 Current Sensor Targets 0.55% Lifetime Accuracy
Allegro ACS37017 Hall-effect current sensor delivers 0.55% typical sensitivity error over temperature and lifetime with reinforced isolation for xEV, AI data center, and industrial power conversion systems.
Read MoreToshiba TCKE6 40V eFuse ICs For Controlled 24V Rail Protection
Toshiba TCKE6 40V eFuse ICs integrate current limiting, overvoltage protection, and thermal shutdown in a compact TSOP6F package for industrial and consumer 3.3V to 30V power rail designs.
Read More