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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Filtering by tag: "bluetooth le"
Clear tag filterMolex Cardinal Assemblies Extend Coaxial Testing Into 145 GHz
Molex’s 145 GHz Cardinal multi port coaxial assemblies enable phase matched, low loss connections for next generation AI, 5G and 6G research, offering repeatable high density testing and data characterization up to 448 Gbps.
Read MoreTDK NTCSP Thermistors Push to 175 C Automotive Operation
TDK expands its NTCSP automotive NTC thermistor series to 175 C operation with AgPd terminations for conductive glue mounting, AEC Q200 qualification, and compact 1.6 x 0.8 mm packaging for power modules and high temperature sensing.
Read MoreAI In Embedded Systems – From Cloud to Chip
Learn why cloud-based AI struggles in embedded and edge systems, and how running AI directly on chips overcomes latency, bandwidth, power, and privacy challenges. Discover how edge AI enables real-time, deterministic, and energy-efficient intelligence while redefining the role of the cloud.
Read MoreMurata ULTICIRC Substrate Targets Low Loss 6G RF Designs
Murata’s ULTICIRC LCP substrate uses an Inner Cavity design to achieve Dk below 2.0 and lower transmission loss for FR3 and 6G RF hardware.
Read MoreAlpha Data launches Versal RF-based platforms for integrated signal processing
Alpha Data introduces COTS platforms built around AMD Versal RF adaptive SoCs with 16 channel direct RF sampling and heterogeneous compute for rapid deployment.
Read MoreBravechip Chiplet Brings Nordic’s nRF54L15 to Next-Gen Smart Rings
Bravechip integrates Nordic’s nRF54L15 SoC into its smart ring chiplet, enabling advanced health monitoring, gesture control, and longer battery life.
Read MoreRosenberger Expands SPE Connector Range for Industrial and Automation Designs
Rosenberger's new RoSPE connectors bring compact, PoDL-capable Single Pair Ethernet to industrial and IIoT environments.
Read MoreToshiba ST2000JXH35A 6500V IEGT Reshapes HVDC Stack Design
Toshiba’s ST2000JXH35A 6500V 2000A press pack IEGT targets HVDC transmission, STATCOM systems and industrial drives with improved turn-off margin and short-circuit withstand capability.
Read MoreNordic Semiconductor Lowers the Barrier to Edge AI in IoT Systems
Nordic Semiconductor introduces the nRF54LM20B SoC, enabling efficient on-device edge AI in low-power IoT systems.
Read MoreNordic Adds Bare Metal Option to nRF Connect SDK for Simpler Bluetooth LE Development
Nordic introduces Bare Metal development in the nRF Connect SDK, easing migration to nRF54L SoCs with a lightweight alternative to Zephyr RTOS.
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