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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Hirose Launches Fully Shielded Hybrid FPC-to-Board Connector Supporting 40 Gbps
Hirose has introduced the BK35 Series, a fully shielded hybrid FPC-to-board connector supporting data rates up to 40 Gbps, RF frequencies up to 40 GHz and four 2.5 A power contacts.
Read MoreYAGEO Introduces PK Series Metal Current Sense Resistors for High-Power Applications
YAGEO has launched the PK Series metal current sense resistors, offering up to 5 W power ratings, resistance values down to 0.5 mΩ and AEC-Q200 qualification for automotive and industrial applications.
Read MoreNXP Combines Automotive Radio and AI Audio Processing in Single Chip
NXP has introduced the SAF9800 automotive processor, combining AM/FM radio reception and AI/ML-enabled audio processing in a single chip. The device integrates a HiFi 5 DSP, neural-network processing and hardware audio accelerators for next-generation infotainment systems.
Read MoreMCC Introduces 40 V Automotive MOSFET with 0.7 mΩ RDS(on)
MCC has introduced the MCACLD70N04YHE3-TP, a 40 V AEC-Q101 qualified N-channel MOSFET featuring a maximum RDS(on) of 0.7 mΩ, 350 A current capability and a DFN5060-C package for automotive and industrial power applications.
Read MoreToshiba Expands S-TOGL MOSFET Lineup with 40 V Automotive Device
Toshiba has introduced the XPJ1R504PB, a 40 V AEC-Q101 qualified N-channel MOSFET for automotive 12 V systems. The S-TOGL packaged device offers 120 A current capability, 1.54 mΩ maximum RDS(on) and improved thermal performance for inverters, motor drives and load switches.
Read MoreDiotec Introduces 750 V SiC MOSFET for 400 V eFuse Applications
Diotec has introduced the DI075SIC055D7, a 750 V SiC MOSFET with 55 mΩ RDS(on) in a D2PAK-7L package for 400 V eFuse and industrial power applications.
Read MoreBourns Introduces Low-Profile Shielded Power Inductors for Automotive Designs
Bourns has introduced the SRP2010PA, SRP2510PA, and SRP2512PA Series shielded power inductors with a metal-alloy powder core, high saturation current, and AEC-Q200 compliance for automotive and DC-DC converter applications.
Read MoreSK Group Chairman Admits that Memory Prices are Abnormally High
Memory prices continue to rise, and the supply of these devices to the consumer market remain tight. But astonishingly, an SK Group Chairman was recently quoted as saying these prices are abnormally high, suggesting that the market may soon face adjustments.
Read MoreChinese Chipmakers Show Strong Growth Despite US Sanctions
As the US continues to apply pressure on China, new reports show that the Chinese semiconductor industry shows positive growth. What exactly has been reported, and does this finally show that such sanction are ineffective?
Read MoreTSMC Confirms Manufacture of A14 Chips in 2028
As chips continue to get smaller, many are left wondering when exactly this shrinkage will stop. Recently, TSMC announced it will be rolling out A14 devices by 2028, meaning that we still have a long way to go.
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