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Filtering by tag: "industrial automation"
Clear tag filterNexperia Brings MLPAK MOSFETs to Automotive Designs
Nexperia’s new MLPAK33-WF and MLPAK56-WF MOSFETs save board space while maintaining thermal and electrical performance for automotive power designs.
Read MoreiDEAL Semiconductor Expands SuperQ MOSFETs to 200 V
iDEAL Semiconductor adds 200 V SuperQ MOSFETs, with a 25 mΩ TO-220 device in production and 5.5 mΩ samples in TOLL and D²PAK-7L.
Read MoreKYOCERA AVX Launches Hermaphroditic Poke-Home Connectors
KYOCERA AVX’s new hermaphroditic poke-home connectors simplify wire-to-wire and wire-to-board terminations for field-ready industrial and lighting systems.
Read MoreRosenberger Expands SPE Connector Range for Industrial and Automation Designs
Rosenberger's new RoSPE connectors bring compact, PoDL-capable Single Pair Ethernet to industrial and IIoT environments.
Read MoreBinder Adds Compact M12 Power Options and Adapters for Legacy Systems
Binder expands M12 Power connector line with compact DC options and adapters for integrating 7/8” systems in industrial automation.
Read MoreSilicon Labs & Wirepas Hit 10M SoC Deployment Milestone
Silicon Labs and Wirepas have surpassed 10 million deployed SoCs in large-scale industrial IoT mesh networks across India, Norway, and beyond.
Read MoreToshiba CCD Sensor Boosts Line-Scan Speed For High-Precision Optical Inspection
Toshiba’s TCD2400DG CCD linear image sensor doubles readout speed, integrates its timing generator and delivers full resolution RGB capture for high speed optical inspection, grain sorting and industrial line scan applications.
Read MoreMicrochip Extends maXTouch M1 Line For Larger And Smaller Auto Displays
Microchip expands its maXTouch M1 controllers to support very large and compact automotive displays with higher SNR and improved touch stability.
Read MoreAmbarella CV7 SoC Supports Multi-Stream 8K Edge AI Vision
Ambarella CV7 enables multi-stream 8K video processing with on-device edge AI for advanced vision systems.
Read MoreMurata ULTICIRC Substrate Targets Low Loss 6G RF Designs
Murata’s ULTICIRC LCP substrate uses an Inner Cavity design to achieve Dk below 2.0 and lower transmission loss for FR3 and 6G RF hardware.
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