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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

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Littelfuse Expands Magnetic Sensing with High-Precision TMR Angle Sensors

LF53466 and LF53464 TMR angle sensors deliver 0–360° measurement, low error rates, and high stability for automotive, industrial, and consumer applications.

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Reducing EMI in High-Speed Designs with Kyocera’s Fully Shielded 5908 Series Connectors

Kyocera’s 5908 Series board-to-board connectors combine full EMI shielding with a compact design, robust locking, and support for PCIe Gen 3 and USB 3.2.

kyocera, board-to-board connector, emi shielding, high-speed connectors, pcie gen 3, usb 3.2, shielded connectors, electronics interconnect, data transmission, connector design, 0.4 mm pitch

US Government Demands Cut from Chip Sales to China

The US Government will now take a 15% cut on all sales for high-end semiconductors to China despite years of bans. So, we must ask ourselves if this move means that semiconductors are not a national security risk, or if this is just an attempt by the US government to raise more money, hurting business interests.

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Diodes AP7372 LDO Regulator Delivers 8μVrms Noise and 90dB PSRR for Precision Electronics

Diodes’ AP7372 LDO offers ultra-low noise, high PSRR, and compact design for powering ADCs, DACs, VCOs, and other sensitive circuits.

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Nichicon Extends ADN Hybrid Capacitor Distribution in EMEA

Nichicon brings its ADN hybrid capacitors to the EMEA market, targeting automotive and industrial designs with high reliability and low ESR.

nichicon, adn capacitors, automotive components, aluminium electrolytic, hybrid capacitor, low esr, emea distribution, ecu, industrial electronics, passive components

KYOCERA AVX Launches Hermaphroditic Poke-Home Connectors

KYOCERA AVX’s new hermaphroditic poke-home connectors simplify wire-to-wire and wire-to-board terminations for field-ready industrial and lighting systems.

kyocera avx, poke-home, hermaphroditic connector, wire-to-wire connector, wire-to-board connector, lighting, industrial, quick termination, passive components, field installation

TDK ICM‑536xx Brings High‑Performance OIS to Mainstream Devices

TDK’s new ICM‑536xx IMU delivers high‑performance optical image stabilization for smartphones, tablets, and cameras in a compact, low‑power MEMS package.

tdk, invensense, imu, mems, ois, image stabilization, motion sensors, mobile devices, smartphones, consumer electronics, sensors, cameras, tablets

AI Discovered Five Materials That Could Replace Lithium In Batteries

As researchers continue to try and find better material choices over lithium for batteries, an AI has recently discovered five potential candidates that could help with this endeavor. What challenges does lithium present, what did the AI discover, and are we looking at the battery problem all wrong?

lithium batteries, energy storage, electric vehicles, battery technology, lithium scarcity, battery safety, environmental impact, lithium mining, battery recycling, multivalent-ion batteries, ai in materials science, generative ai, sustainable batteries, battery alternatives, charging infrastructure, fast charging, battery cycle life, njit research, battery materials discovery, transition metal oxides

HARTING Launches Han Protect, PushPull, and SPE for Smarter Factory Systems

HARTING introduces Han Protect, D-Sub PushPull, and SPE to support smart factories and connected infrastructure with better maintainability, speed, and efficiency.

harting, han protect, d-sub pushpull, single pair ethernet, spe, connectors, factory automation, rail systems, control cabinet, industrial ethernet, panel design, maintenance, power and data, smart manufacturing

NOVOSENSE Tackles GaN Drive Complexity with Integrated High-Voltage Half-Bridge Driver

NOVOSENSE's NSD2622N half-bridge driver integrates gate bias generation for E-mode GaN, simplifying high-voltage designs and improving reliability.

novosense, nsd2622n, gan driver ic, half-bridge driver, enhancement-mode gan, dv/dt immunity, gate voltage regulation, bootstrap driver, power electronics, high voltage, switching speed, driver integration, wide bandgap

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