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Filtering by tag: "smartphones"
Clear tag filterHirose Launches Fully Shielded Hybrid FPC-to-Board Connector Supporting 40 Gbps
Hirose has introduced the BK35 Series, a fully shielded hybrid FPC-to-board connector supporting data rates up to 40 Gbps, RF frequencies up to 40 GHz and four 2.5 A power contacts.
Read MoreInfineon Shrinks Mobile Power Paths With CoolGaN BDS
Infineon has expanded its CoolGaN BDS 40 V G3 family with two bidirectional GaN switching devices for smartphones, notebooks, and wearables, reducing PCB footprint while improving switching and leakage performance.
Read MoreTDK Noise Filter Targets Audio Lines Without the Usual Tradeoff
TDK’s MAF0603GWY series targets RF noise on audio lines in phones and wearables, combining strong attenuation above 5 GHz with lower distortion and lower resistance than conventional chip-bead approaches.
Read MoreTDK Brings High-Inductance Thin-Film Parts to Optical Transceivers in AI Data Centers
TDK’s new 10 µH thin-film inductor delivers low resistance and high reliability for optical transceivers in AI data centres.
Read MoreTDK ICM‑536xx Brings High‑Performance OIS to Mainstream Devices
TDK’s new ICM‑536xx IMU delivers high‑performance optical image stabilization for smartphones, tablets, and cameras in a compact, low‑power MEMS package.
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