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TI 800 VDC Power Architecture Reduces Conversion Stages

Texas Instruments introduces an 800 VDC power architecture aligned with NVIDIA that reduces AI data center power delivery to two stages, removing intermediate rails and shifting constraints toward high-density local conversion.

Texas Instruments, NVIDIA, AI Data Centers, 800VDC, Power Conversion, GPU Power Delivery, HVDC, Data Center Power, DC-DC Conversion, Power Architecture, AI Infrastructure, GaN Power, Multiphase Buck, High Voltage, Server Design

STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

STMicroelectronics expands its 800 VDC power architecture with new 12V and 6V conversion stages, enabling more efficient power delivery closer to GPUs in high-density AI data center infrastructure.

STMicroelectronics, 800 VDC, data center power, AI infrastructure, GPU power delivery, high voltage distribution, DC power conversion, power architecture, server power design, GaN power, SiC power, power electronics, data center efficiency, GPU servers, power density

NXP and NVIDIA Target Real-Time Data Flow in Robots

NXP and NVIDIA introduce a robotics architecture using Holoscan Sensor Bridge to enable real-time data transport, sensor fusion, and synchronized motor control in humanoid and edge AI systems.

NXP, NVIDIA, Holoscan Sensor Bridge, robotics architecture, humanoid robots, edge AI, sensor fusion, real-time systems, time-sensitive networking, TSN, machine vision, motor control, embedded processors, distributed systems, robotics networking

EPC’s EPC91202 GaN Inverter Board Pushes BLDC Drives to 150 kHz

EPC’s EPC91202 GaN inverter evaluation board delivers up to 50 ARMS phase current and 150 kHz PWM switching for high-density BLDC motor drive development in robotics, drones, and e-mobility systems.

Efficient Power Conversion, EPC, EPC91202, EPC2361, eGaN FET, gallium nitride power devices, GaN motor drives, BLDC inverter, three phase inverter, motor control electronics, robotics motor drives, drone propulsion electronics, eMobility motor drives, field oriented control, space vector PWM, power electronics

Nanopower nPZero IC Changes How IoT Sensors Use Energy

Nanopower’s nPZero power-saving IC allows IoT devices to monitor up to four sensors while the host MCU remains powered down, reducing system energy consumption and enabling longer battery life in remote sensing applications.

Nanopower Semiconductor, nPZero, power saving IC, PSIC, IoT power management, sensor monitoring IC, ultra low power electronics, energy harvesting IoT, IoT battery optimization, embedded power control, event driven sensing, industrial IoT sensors, asset tracking electronics, smart agriculture monitoring, low power system design

Telit Dual-Band GNSS Modules Improve IoT Positioning

Telit Cinterion introduces SE873K5-D and SE869eK5-DRK GNSS modules with dual-band L1+L5 reception, RTK positioning and dead reckoning for reliable IoT navigation in challenging environments.

Telit, Telit Cinterion, GNSS module, dual band GNSS, L1 L5 GNSS, RTK GNSS, dead reckoning GNSS, IoT positioning module, satellite positioning, asset tracking GNSS, drone navigation GNSS, multi constellation GNSS, RTCM corrections, AG3335 chipset, embedded GNSS receiver

Diodes AL8859Q Boost Controller Powers Adaptive Automotive Lighting

Diodes AL8859Q multi-phase SPI boost controller enables 100 W to 400 W automotive LED headlight power stages with 4.5 V to 60 V input range and spread-spectrum EMI reduction.

Diodes Incorporated, AL8859Q, Boost Controller, Automotive Boost Converter, Automotive Power Management, Automotive LED Lighting, Adaptive Front Lighting, Automotive Electronics, SPI Boost Controller, Multi-Phase Boost Converter, Automotive DC-DC Converter, Automotive Power Systems, CISPR 25 EMI, Automotive Lighting Systems, Power Electronics

Advanced Energy LPP200 AC-DC Supplies Target Sub-1 Inch Systems

Advanced Energy introduces the LPP200 series, a 200 W low-profile AC-DC power supply measuring just 0.75 inches high and designed for compact medical and industrial equipment requiring high power density and strict safety compliance.

Advanced Energy, LPP200, AC-DC Power Supply, Medical Power Supply, Industrial Power Supply, Low Profile Power Supply, Open Frame Power Supply, Power Density, Embedded Power, Medical Electronics, IEC 60601-1, IEC 62368, Compact Power Conversion, Patient Monitor Power, Infusion Pump Power, Industrial Equipment Power, Power Electronics

Navitas GeneSiC SiC MOSFETs Add QDPAK and Low-Profile TO-247

Navitas expands its 5th-generation GeneSiC silicon carbide MOSFET portfolio with top-side cooled QDPAK and low-profile TO-247-4L packages designed for AI data centers, grid infrastructure, and industrial power systems operating at 1200 V.

Navitas Semiconductor, Navitas GeneSiC, SiC MOSFET, Silicon Carbide MOSFET, Power Semiconductors, 1200 V MOSFET, QDPAK Package, TO-247-4L Package, Top-Side Cooling, Power Electronics, AI Data Center Power, Industrial Electrification, Energy Infrastructure, High-Voltage Switching, Trench Assisted Planar, SiC Power Devices, High Power Density, Power Conversion Systems

Toshiba Photorelays Push Switching Reliability to 135°C

Toshiba introduces compact S-VSON4T photorelays rated for 135°C operation with integrated input resistors, designed for automated test equipment, probe cards, and burn-in systems.

Toshiba, photorelay, TLP3407SRB, TLP3412SRB, TLP3412SRHB, TLP3412SRLB, optoelectronic relay, solid state relay, automated test equipment, semiconductor tester, probe card switching, burn in systems, signal switching, high temperature electronics, S-VSON4T package

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