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AI Designs Chip And It Works, But Should We Use It?

Recently, researchers demonstrated the capabilities of AI with a chip that it designed, which proved to be extremely capable. But while the chip is impressive, we don’t fully understand why it works. What challenges does advanced designs introduce, what did the researchers do, and should we encourage the use of AI-designed hardware?

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Digi IX25 Brings 5G, Edge Compute, and eSIM to Industrial Networking

Digi International’s IX25 is a rugged industrial router platform combining LTE, 5G RedCap, and 5G eMBB with four Ethernet ports, Linux container support, active eSIM provisioning, and centralized fleet management for critical infrastructure deployments.

Digi International, Digi IX25, industrial router, 5G router, cellular router, LTE router, 5G RedCap, 5G eMBB, industrial networking, edge computing, eSIM, Digi Remote Manager, private LTE, private 5G, CBRS, FirstNet, utilities, oil and gas, SCADA, industrial IoT

New Radiation-Resistant Wi-Fi Chip Could Power Nuclear Robotics

Recently, researchers created a Wi-Fi solution capable of operating in extreme radiation environments. What challenges does radiation present, what did the researchers develop, and why is it so exciting?

wireless, rf, silicon, radiation, rad, nuclear, industry, interference

Würth Elektronik Introduces New Coaxial Connectors for 50-Ω Cable Applications

Würth Elektronik introduces compact SMA, SMB, MCX, and MMCX coaxial cable connectors with gold contacts and IP67 options for RF applications.

Würth Elektronik, RF connectors, coaxial connectors, SMA, SMB, MCX, MMCX, wireless, IoT, GPS, test equipment, gold plated contacts, 6 GHz, Connectors

Silicon Labs & Wirepas Hit 10M SoC Deployment Milestone

Silicon Labs and Wirepas have surpassed 10 million deployed SoCs in large-scale industrial IoT mesh networks across India, Norway, and beyond.

Silicon Labs, Wirepas, IoT, Industrial IoT, Smart Metering, Mesh Networking, Smart Grid, Embedded Systems, Sub GHz, Edge Connectivity, FG23, Wireless SoC, Smart Infrastructure

TE Connectivity Launches Modular MULTIGIG TRX Platform for Rugged Fibre Optic Applications

TE Connectivity has launched its MULTIGIG TRX platform, a modular fibre optic transceiver system for aerospace, defence, and marine markets. Featuring up to 12 hot-swappable 10 Gbps transceivers, it enables faster data, simplified upgrades, and minimal downtime. Qualified to standards like DO-160G and MIL-STD-883, the platform offers high-speed connectivity in rugged environments and supports future expansion without reworking the PCB or replacing the full module.

TE Connectivity, MULTIGIG TRX, fibre optics, modular transceivers, aerospace connectors, rugged data systems, in flight entertainment, MIL STD 883, DO 160G, Light Engine Platform

Molex Cardinal Assemblies Extend Coaxial Testing Into 145 GHz

Molex’s 145 GHz Cardinal multi port coaxial assemblies enable phase matched, low loss connections for next generation AI, 5G and 6G research, offering repeatable high density testing and data characterization up to 448 Gbps.

Molex, Cardinal assemblies, 145GHz testing, high frequency coax, mmWave, 6G research, AI hardware validation, satellite communications, radar systems, coaxial connectors, test and measurement, phase matched assemblies, high data rate test, RF characterization, wideband signal integrity

TDK NTCSP Thermistors Push to 175 C Automotive Operation

TDK expands its NTCSP automotive NTC thermistor series to 175 C operation with AgPd terminations for conductive glue mounting, AEC Q200 qualification, and compact 1.6 x 0.8 mm packaging for power modules and high temperature sensing.

TDK, NTC thermistor, NTCSP series, automotive temperature sensor, AEC Q200, high temperature electronics, 175 C operation, conductive glue mounting, AgPd terminals, power semiconductor monitoring, EV power module, ABS electronics, transmission control, engine electronics, thermal compensation, B constant, 10k thermistor, 100k thermistor

AI In Embedded Systems – From Cloud to Chip

Learn why cloud-based AI struggles in embedded and edge systems, and how running AI directly on chips overcomes latency, bandwidth, power, and privacy challenges. Discover how edge AI enables real-time, deterministic, and energy-efficient intelligence while redefining the role of the cloud.

edge ai, embedded systems, cloud ai, ai accelerators, npus, real-time systems, low-power ai, on-device inference, industrial automation, iot, privacy, data sovereignty, model optimization, microcontrollers, edge computing

Murata ULTICIRC Substrate Targets Low Loss 6G RF Designs

Murata’s ULTICIRC LCP substrate uses an Inner Cavity design to achieve Dk below 2.0 and lower transmission loss for FR3 and 6G RF hardware.

murata, ulticirc, lcp substrate, rf materials, 6g, fr3, dielectric constant, low loss substrate, flexible pcb, high frequency design, antennas, beamforming, rf modules

AI Designs Chip And It Works, But Should We Use It?

Digi IX25 Brings 5G, Edge Compute, and eSIM to Industrial Networking

New Radiation-Resistant Wi-Fi Chip Could Power Nuclear Robotics

Würth Elektronik Introduces New Coaxial Connectors for 50-Ω Cable Applications

Silicon Labs & Wirepas Hit 10M SoC Deployment Milestone

TE Connectivity Launches Modular MULTIGIG TRX Platform for Rugged Fibre Optic Applications

Molex Cardinal Assemblies Extend Coaxial Testing Into 145 GHz

TDK NTCSP Thermistors Push to 175 C Automotive Operation

AI In Embedded Systems – From Cloud to Chip

Murata ULTICIRC Substrate Targets Low Loss 6G RF Designs

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