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TE Connectivity Launches Modular MULTIGIG TRX Platform for Rugged Fibre Optic Applications

TE Connectivity has launched its MULTIGIG TRX platform, a modular fibre optic transceiver system for aerospace, defence, and marine markets. Featuring up to 12 hot-swappable 10 Gbps transceivers, it enables faster data, simplified upgrades, and minimal downtime. Qualified to standards like DO-160G and MIL-STD-883, the platform offers high-speed connectivity in rugged environments and supports future expansion without reworking the PCB or replacing the full module.

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Molex Cardinal Assemblies Extend Coaxial Testing Into 145 GHz

Molex’s 145 GHz Cardinal multi port coaxial assemblies enable phase matched, low loss connections for next generation AI, 5G and 6G research, offering repeatable high density testing and data characterization up to 448 Gbps.

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TDK NTCSP Thermistors Push to 175 C Automotive Operation

TDK expands its NTCSP automotive NTC thermistor series to 175 C operation with AgPd terminations for conductive glue mounting, AEC Q200 qualification, and compact 1.6 x 0.8 mm packaging for power modules and high temperature sensing.

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AI In Embedded Systems – From Cloud to Chip

Learn why cloud-based AI struggles in embedded and edge systems, and how running AI directly on chips overcomes latency, bandwidth, power, and privacy challenges. Discover how edge AI enables real-time, deterministic, and energy-efficient intelligence while redefining the role of the cloud.

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Murata ULTICIRC Substrate Targets Low Loss 6G RF Designs

Murata’s ULTICIRC LCP substrate uses an Inner Cavity design to achieve Dk below 2.0 and lower transmission loss for FR3 and 6G RF hardware.

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Alpha Data launches Versal RF-based platforms for integrated signal processing

Alpha Data introduces COTS platforms built around AMD Versal RF adaptive SoCs with 16 channel direct RF sampling and heterogeneous compute for rapid deployment.

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Rosenberger Expands SPE Connector Range for Industrial and Automation Designs

Rosenberger's new RoSPE connectors bring compact, PoDL-capable Single Pair Ethernet to industrial and IIoT environments.

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Toshiba ST2000JXH35A 6500V IEGT Reshapes HVDC Stack Design

Toshiba’s ST2000JXH35A 6500V 2000A press pack IEGT targets HVDC transmission, STATCOM systems and industrial drives with improved turn-off margin and short-circuit withstand capability.

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Samtec AcceleRate Slim Cables Add More Flexible Signal Routing

Samtec’s AcceleRate Slim ARC6 cable assemblies now include single-ended and mixed-signaling options, extending their use in dense computing, FPGA prototyping, emulation, and MIPI systems while retaining the narrow body and direct-attach cable architecture.

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Bourns Expands MF-MSMF PPTC Fuse Line For Higher Power Ports

Bourns adds 35 MF-MSMF PPTC models with higher hold currents and 60 V ratings for low voltage port protection.

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