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ODU Expands ODU-MAC Black-Line With Compact Mass Interconnect

Compact Class platform brings 1,536 signal points and modular receiver options to space constrained test systems.

odu, odu-mac, black-line, compact class, mass interconnect, test systems, ate, signal switching, connectors, high density, modular interconnect

Bourns Expands MF-MSMF PPTC Fuse Line For Higher Power Ports

Bourns adds 35 MF-MSMF PPTC models with higher hold currents and 60 V ratings for low voltage port protection.

bourns, mf-msmf, pptc, resettable fuse, overcurrent protection, 60 v, polymer ptc, usb protection, hdmi protection, consumer electronics, data center, port protection

Melexis MLX91299 RC Snubber Boosts SiC Module Reliability

Silicon RC snubber reduces SiC switching losses and stabilises high-voltage modules for automotive and industrial designs.

melexis, mlx91299, rc snubber, silicon snubber, sic module, power electronics, high voltage, traction inverter, onboard charger, industrial drives

Toshiba 600 V Super Junction MOSFET Targets High-Density Power Systems

Toshiba’s TK057V60Z brings lower loss and a compact DFN8×8 package to 600 V power supplies used in data centres, UPS systems and solar equipment.

toshiba, tk057v60z, dtmosvi, super junction mosfet, 600 v mosfet, dfn8×8, kelvin source, power supplies, ups, data centre, photovoltaic, switching efficiency

Infineon's HYPERRAM Validated on AMD Spartan FPGA for Low Pin Designs

Infineon HYPERRAM and controller IP are now tested on the AMD Spartan SCU35 FPGA to enable low pin external memory for MicroBlaze V designs.

infineon, hyperram, hyperbus, amd spartan ultrascale plus, scu35, external memory, microblaze v, risc v, low pin interface, fpga design

STMicroelectronics NFC Chip Simplifies Matter Device Onboarding

ST’s ST25DA C enables secure tap based onboarding for Matter 1.5 devices using energy harvesting to support power free commissioning.

stmicroelectronics, st25da c, matter 1.5, nfc commissioning, secure element, type 4 tag, smart home, iot onboarding, energy harvesting

ROHM 100 V MOSFET Supports 48 V AI Server Hot-Swap in 5×6 mm Package

ROHM’s RS7P200BM provides wide SOA and low RDSon in a compact 5×6 mm package for 48 V AI server and industrial power protection.

rohm, rs7p200bm, 100 v mosfet, wide soa, 48 v hot swap, dfn5060, data centre power, ai servers, industrial power, battery protection

Littelfuse 200 V X4-Class MOSFET Targets High-Current Power Systems

The Littelfuse MMIX1T500N20X4 delivers 200 V and 480 A performance with topside cooling for compact high current power systems.

littelfuse, mmix1t500n20x4, x4 class mosfet, 200 v mosfet, 480 a current, smpd x package, topside cooling, power density, energy storage, industrial charging

AMD MI300X Enables Large-Scale MoE Training for Zyphra

Zyphra trains its ZAYA1 MoE model on AMD MI300X GPUs without sharding, using 192 GB memory and faster I O to simplify large scale AI training.

amd, zyphra, mi300x, zaya1, moe model, high bandwidth memory, ai training, gpu architecture, rocm, pensando networking, ibm cloud

ABLIC S-19560B PMIC Reduces Camera Module Power Footprint

ABLIC’s S-19560B PMIC integrates three power rails in a compact package to shrink automotive camera modules and improve thermal efficiency.

ablic, s-19560b, pmic, camera module power, automotive cameras, adas, dms, power sequencing, hsnt-8 package, high-psrr ldo, multi-rail supply, thermal design

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