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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

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ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

rohm, dot-247, silicon carbide, sic module, power electronics, pv inverters, ups systems, multi-level inverters, half-bridge, common-source, aec-q101, industrial power

Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.

wolfspeed, silicon carbide, 200mm, sic wafers, power devices, mosfet yield, automotive, ev, renewables, power electronics

Infineon Unveils 12 kW High-Density PSU Reference Design for AI Data Centers

Infineon’s 12 kW PSU reference design hits over 99% efficiency and 113 W/in³ power density using Si, SiC, and GaN technologies.

infineon, psu, ai data centers, high-efficiency power conversion, wide-bandgap, sic, gan, power factor correction, llc resonant converter, energy buffer, power density

Digi Launches Medical-Grade Serial Server for Patient Care

Digi’s Connect EZ 4 WS bridges medical serial equipment to modern networks with IEC 60601-1 compliance, encryption, Wi-Fi, and remote management.

digi international, connect ez 4 ws, serial server, iec 60601-1, medical device networking, healthcare it, emr integration, realport, python automation, cybersecurity

SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

sk hynix, hbm4, high bandwidth memory, ai infrastructure, data center, mr-muf, dram, memory packaging, 2, 048 i/o, semiconductor manufacturing

Deca and SST Partner to Advance NVM Chiplet Architectures

Deca and SST join forces to deliver modular NVM chiplets, combining Adaptive Patterning and SuperFlash technologies for advanced multi-die systems.

deca, silicon storage technology, microchip, chiplets, nvm, superflash, adaptive patterning, semiconductor packaging, heterogeneous integration, multi-die systems, advanced packaging

TI TMAG5134 Hall-Effect Switch Reaches 1 mT Sensitivity

Texas Instruments’ TMAG5134 Hall-effect switch detects magnetic fields down to 1 mT, enabling smaller magnets, lower system cost, and longer battery life.

texas instruments, ti, tmag5134, hall effect switch, in-plane sensor, magnetic sensing, 1 mt sensitivity, low power, timss, reed switch replacement, tmr, amr, gmr, door sensors, appliances, consumer electronics

Nexperia Brings MLPAK MOSFETs to Automotive Designs

Nexperia’s new MLPAK33-WF and MLPAK56-WF MOSFETs save board space while maintaining thermal and electrical performance for automotive power designs.

nexperia, mlpak, mlpak33-wf, mlpak56-wf, mosfet, automotive, zonal architecture, body control, lighting, reverse battery protection, dc/dc converter, aec-q101, wettable flank

Could Thousand Core RISC-V Devices Be The Key To Future Processors

Modern processors are reaching their limits not because of raw speed, but because of the growing gap between compute and memory. Could thousands of RISC-V cores sitting directly next to RAM be the way forward, and are we ready to abandon legacy architectures in favor of parallel-first designs?

processors, risc-v, thousand-core cpu, xcena, mx1, computational memory, near-data processing, cxl 3.2, ai acceleration, data centers, server architecture, memory bottleneck, future computing, parallel processing

Littelfuse DFNAK3 Compact TVS Diodes Handle 3 kA Surges

Littelfuse DFNAK3 Series TVS diodes deliver 3 kA surge protection in a compact DFN package, saving 70% PCB space for PoE, telecom, and data center systems.

littelfuse, dfnak3, tvs diode, transient voltage suppressor, surge protection, compact dfn, 3 ka, iec 61000-4-5, poe, telecom, remote radio unit, baseband unit, data center, ai infrastructure, industrial power

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