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Infineon Expands OptiMOS 6 Portfolio with 150 V Automotive MOSFETs

Infineon’s OptiMOS 6 150 V MOSFETs deliver 2.5 mΩ RDS(on), low switching losses, and thermal resistance of 0.4 K/W, with TOLL, TOLG, and TOLT packaging for xEV designs.

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Kioxia Ships 512Gb TLC 9th Gen BiCS FLASH for AI and IoT

Kioxia begins sampling its 9th-gen 512Gb TLC BiCS FLASH™ memory, boosting performance and power efficiency for SSDs, AI, and industrial IoT.

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Bourns Announces High-Heat Thick Film Resistor Series

Bourns unveils the PF2270 resistor series in a compact TO-227 package, supporting up to 300W power dissipation and high-temperature operation.

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Cetecom Advanced Certifies Rohde & Schwarz Test System for NG eCall Verification

Cetecom Advanced certifies Rohde & Schwarz’s NG eCall test solution for 4G/5G IMS-based vehicle emergency call systems, in compliance with EN 17240:2024.

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KYOCERA AVX Launches Compact 3dB Hybrid Couplers

KYOCERA AVX releases miniature 3dB hybrid couplers for RF systems operating from 3–4.1GHz, supporting 5G, automotive, satellite, and IoT applications.

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China Unveils Worlds-First 35 Micron Ultra-Thin Power Wafer Production Line

Recently, China announced that it has developed the world's thinnest power wafers at 35 microns. But why exactly does this matter, how has China achieved this, and what does it mean for the rest of the world?

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Navitas GeneSiC SiC MOSFETs Add QDPAK and Low-Profile TO-247

Navitas expands its 5th-generation GeneSiC silicon carbide MOSFET portfolio with top-side cooled QDPAK and low-profile TO-247-4L packages designed for AI data centers, grid infrastructure, and industrial power systems operating at 1200 V.

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RECOM RMD40-UW and RMD75-UW DC/DCs Simplify Railway Power Design

RECOM introduces 40 W and 75 W railway DC/DC modules with ultra-wide input range and full EN50155 compliance.

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UltraRAM Technology Now Volume Scales, The Future of Memory

As UltraRAM moves into production, many are left wondering if it could become the future memory technology. What challenges does memory face, what is UltraRAM, and could it be the solution for the future?

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Does China’s Zombie Fabs Threaten Its Semiconductor Capabilities?

China’s semiconductor ambitions have faced billions in wasted investment and a trail of abandoned fabs, challenging its drive for self-reliance. But are these costly setbacks merely growing pains on the path to true technological independence, or signs of deeper struggles ahead?

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