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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Complementary Field-Effect Transistors – Approaching the 0.2nm Realm

As researchers continue to push the limits of what semiconductor technologies can do, it is clear that the next transistor technology to dominate will be the Complementary Field-Effect Transistor (CFET). What challenges do current transistors face, what are CFETs, and how will they empower the future?

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Toshiba Targets AI Data Center Power Stages With 1200V SiC MOSFET

Toshiba has started test-sample shipments of the TW007D120E, a 1200V trench-gate SiC MOSFET in a top-side cooled QDPAK package for AI data center power supplies and 800V HVDC architectures.

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Würth Elektronik Adds I²C Digital Isolators For Signal Isolation

Würth Elektronik has introduced the WPME-CDI2C family of 2-channel digital isolators for I²C interfaces, supporting bidirectional data transmission up to 2 MHz, 3750 VRMS isolation, and ±150 kV/µs CMTI.

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Infineon Shrinks Mobile Power Paths With CoolGaN BDS

Infineon has expanded its CoolGaN BDS 40 V G3 family with two bidirectional GaN switching devices for smartphones, notebooks, and wearables, reducing PCB footprint while improving switching and leakage performance.

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Nisshinbo Targets Long-Life IoT Nodes With 85 nA Buck Regulator

Nisshinbo Micro Devices has introduced the NC2650 Series, a 1 A synchronous buck regulator with 85 nA quiescent current, automatic PWM/PFM switching, and compact WLCSP packaging for IoT, wearable, and battery-powered sensor designs.

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Vishay Targets EV Isolation Stages with New Automotive Optocouplers

Vishay has introduced the VOWA617A and VOWA618A Automotive Grade optocouplers for EV and solar inverter isolation stages, featuring 11 mm creepage distance, 1500 Vpeak VIORM, and CTI 600 insulation performance.

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JAE Targets Compact Collaborative Robots with KN07 Connectors

JAE has introduced the KN07 Series compact composite connectors for industrial and collaborative robots, combining up to 72 power and signal contacts with IP67 protection and one-touch locking.

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TDK Expands Micro POL Modules for AI Edge Power Rails

TDK has introduced the FS3303 micro POL power module for AI edge systems and optical networking hardware, delivering 3 A in a 2.5 mm × 2.5 mm package with integrated power components.

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AOS Targets Intel Panther Lake with New IMVP9.3 Power Controllers

Alpha and Omega Semiconductor has introduced new IMVP9.3 multiphase controllers and Smart Power Stages for Intel Panther Lake and Wildcat Lake laptops, targeting lower idle power, faster transient response, and denser mobile CPU power layouts.

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Toshiba SmartMCD Integrates MCU and MOSFETs for BLDC Drives

Toshiba has started sampling the TB9M040FTG SmartMCD device, integrating an Arm Cortex-M23 MCU, MOSFETs, LIN transceiver, and BLDC motor driver into a compact package for automotive motor control systems below 40 W.

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