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Nexperia Launches 1V ESD Protection Diodes for USB4 and Thunderbolt Interfaces

Nexperia’s new ESD diodes safeguard USB4 and Thunderbolt lines with ultra-low capacitance, high surge handling, and minimal signal loss at 10 GHz+.

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Renesas Adds AI Muscle to Edge HMI Systems with New 64-bit RZ/G3E MPU

The Renesas RZ/G3E MPU combines a quad-core Arm Cortex-A55 with an NPU for edge AI and Full HD HMI applications in industrial and consumer systems.

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TDK Launches Industry’s Highest-Capacitance 100 V MLCC in 1608 Size

TDK launches a 1 µF, 100 V MLCC in 1608 size, the industry’s highest capacitance for this spec, supporting BOM reduction in 48 V and industrial systems.

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Qatar Airways Cargo Launches TechLift Solution for Semiconductor Industry

Qatar Airways Cargo has launched TechLift, a specialized air cargo solution designed to meet the unique transportation needs of the semiconductor industry. Featuring advanced technologies like real-time monitoring, shock-absorbing equipment, and priority loading, TechLift ensures the safe and efficient delivery of sensitive semiconductor components. This innovation aims to enhance supply chain transparency and resilience in a sector critical to modern technology.

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TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

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iDEAL Semiconductor SuperQ 200V MOSFETs Push RDS(on) Lower in Standard Packages

iDEAL Semiconductor introduces SuperQ 200 V MOSFETs delivering industry-low RDS(on) in TOLL and TO-220 packages. Devices target motor drives, SMPS, and high-current industrial power stages.

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Japan To Extract Rare Earth Minerals From Old Motors To Fight China

Japan is turning to recycling old motors and printed circuit boards to secure rare earth minerals like neodymium, reduce reliance on China, and strengthen its supply chain amid rising geopolitical and industrial risks.

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TDK NTCSP Thermistors Push to 175 C Automotive Operation

TDK expands its NTCSP automotive NTC thermistor series to 175 C operation with AgPd terminations for conductive glue mounting, AEC Q200 qualification, and compact 1.6 x 0.8 mm packaging for power modules and high temperature sensing.

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YAGEO’s Ground-Plane-Independent 2×2 MiMo Antenna Targets Reliable Wi-Fi 6E/7 In Harsh Installations

YAGEO’s LPTNG2471M2DMG0457 2×2 MiMo antenna provides ground plane independent Wi Fi 6E and Wi Fi 7 coverage up to 7.125 GHz with stable performance on metallic or non metallic enclosures, designed for rugged industrial and outdoor connectivity.

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Researchers Create Flexible AI Chip For Smart Wearables

Researchers develop FLEXI, a flexible AI chip for wearables, enabling local computation, extreme bending tolerance, and energy-efficient edge intelligence.

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