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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

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Toshiba Begins Mass Production of TXZ+ Entry-Class M4L Motor Control Microcontrollers

Toshiba has begun mass production of its TXZ+ Entry-Class M4L microcontrollers, combining dedicated motor control hardware, security features and up to 256 KB of flash memory.

Toshiba, TXZ+, M4L Group, Arm Cortex-M4, Microcontroller, MCU, Motor Control, Field-Oriented Control, FOC, Embedded, Industrial, Factory Automation, Home Appliances, Functional Safety, Electronic Components

Silicon Labs Introduces BG2B Bluetooth LE SoC with Channel Sounding and Integrated CAN-FD

Silicon Labs has introduced the BG2B Bluetooth LE SoC, combining Bluetooth 6 Channel Sounding, Secure Vault High security, CAN-FD and ultra-low-power operation.

Silicon Labs, BG2B, Bluetooth LE, Bluetooth 6, Wireless SoC, Channel Sounding, Secure Vault, CAN-FD, IoT, RF, Wireless, Low Power, Electronic Components, ADC, Embedded

NetBSD 11.0 Ships First 64-bit RISC-V Port with 10ms Boot

As RISC-V continues to grow in importance across the embedded world, NetBSD has released its first stable RISC-V port that can support boot times as fast as 10ms. What exactly has been announced and why is this important for RISC-V?

NetBSD 11.0, 64-bit RISC-V port, NetBSD RISC-V support, open-source operating system, fast boot time, 10ms boot, StarFive VisionFive 2, STAR64, QEMU virtualization, PCIe support, Linux compatibility, MICROVM kernel, firewall improvements, Qualcomm Snapdragon X Elite, open hardware software stack, BSD operating system, RISC-V ISA, kernel performance, software compatibility, portable OS, embedded systems, processor architecture, open instruction set

China’s Chip Output Has Increased 350% Over the Past Decade

As predicted, the latest stats have shown that chip output in China has jumped 350% over the past decade, with China dominating the legacy semiconductor market. So what exactly do the numbers tell us, and why is this a sign for the West to change its tactics?

China semiconductor output, legacy chip production, mature-node semiconductors, global semiconductor market share, CXMT DDR4 HBM, semiconductor supply chain, Western semiconductor dependency, South Korea semiconductor industry, legacy DRAM market, power semiconductors, AMS1117 3.3V shortage, semiconductor manufacturing expansion, Western manufacturing vulnerability, semiconductor industry strategy

CXMT Now Looking To Produce LPDDR6

CXMT keeps hitting the headlines with its investments and desire to tackle the memory market, and now, it seems that it is looking to provide LPDDR6 to the world. So what exactly is CXMT looking to do, and could this be the first stepping stone that allows China to enter the world memory market?

CXMT, LPDDR6 memory, China memory market, DRAM production, advanced memory technology, AI memory chips, mobile device memory, SK Hynix LPDDR6, Apple memory sourcing, Chinese DRAM, memory market competition, memory supply chain, high-speed DRAM, LPDDR6 commercialization, memory price inflation, server memory solutions, consumer electronics memory, memory manufacturing China

Bourns Introduces FLP Series LTCC Low-Pass Filters Covering DC to 3.8 GHz

Bourns has introduced the FLP Series, a family of nine LTCC low-pass filters covering DC to 3.8 GHz for IoT, LTE, GNSS and 5G wireless communication designs.

Bourns, FLP Series, LTCC, Low-Pass Filter, RF Filter, Wireless Communications, IoT, LTE, GNSS, 5G, Passive Components, Ceramic Filter, RF Design, Electronic Components, PCB

Murata Introduces 1210 Common-Mode Choke for 10Base-T1S Automotive Ethernet

Murata has commercialized the DLW32MH241MX2, a 1210-size AEC-Q200 common-mode choke coil meeting OPEN Alliance Class 3 requirements for 10Base-T1S automotive Ethernet.

Murata, DLW32MH241MX2, Common Mode Choke, EMI Filter, Automotive Ethernet, 10Base-T1S, OPEN Alliance, AEC-Q200, Ferrite, Passive Components, EMC, Ethernet, Automotive, Noise Suppression, Electronic Components

Renesas Introduces Gen 3 DDR5 MRDIMM Chipset with 16,000 MT/s Performance

Renesas has introduced its Gen 3 DDR5 MRDIMM chipset, delivering up to 16,000 MT/s memory performance while maintaining compatibility with existing DDR5 server infrastructure.

Renesas, DDR5, MRDIMM, Memory, Server Memory, MRCD, MDB, DRAM, HPC, AI Servers, Data Centre, PMIC, SPD Hub, Memory Interface, Electronic Components

Toshiba Introduces 2 A Photorelays with Ultra-Low OFF-State Leakage

Toshiba has introduced the TLP3487 and TLP3491 photorelays, combining 2.0 A switching capability with ultra-low OFF-state leakage for semiconductor test systems.

Toshiba, Photorelay, Solid-State Relay, MOSFET, Semiconductor Test, Automated Test Equipment, ATE, P-SON4, Switching, Low Leakage, Test & Measurement, Logic IC, SoC, Memory Testing, Electronic Components

DigiKey Adds More Than 27,000 New Stocking Products and 104 Suppliers in Q2

DigiKey expanded its portfolio with more than 27,000 new stocking products and 104 suppliers during Q2 2026, increasing component availability across multiple categories.

DigiKey, Distribution, Electronic Components, New Products, New Suppliers, Connectors, Sensors, Inductors, ADCs, IoT, Industrial Electronics, Prototyping, Marketplace, Supply Chain, Electronics Distribution

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