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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Vishay Launches First Automotive Y1-Rated Ceramic Capacitors in SMD Package

Vishay’s SMDY1 Automotive Series are the first Y1-rated ceramic capacitors in SMD format, combining 500 VAC rating, 4.7 nF capacitance, and Class IIB humidity grade for EV power systems.

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ABLIC S-57W1/W2 Dual Hall ICs Simplify Motor Feedback in Space-Constrained Designs

ABLIC’s S-57W1/W2 integrates two Hall elements in one IC, giving engineers high-resolution speed and direction feedback without using two sensors.

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TDK Introduces SmartMotion ICM-45685 IMU for Next-Generation Smart Glasses

TDK’s new ICM-45685 SmartMotion IMU delivers precise head tracking, OIS/EIS, and activity recognition for AR and AI glasses at ultra-low power.

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Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.

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Renesas Adds Capacitive Touch to Its Smallest, Lowest-Power RA0 MCUs

Renesas expands its RA0 MCU line with the RA0L1 series, adding built-in capacitive touch, ultra-low-power operation, and fast wake-up for cost-sensitive consumer, industrial, and battery-powered applications.

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TI Expands C2000 MCU Line for High-Performance, Low-Cost Motor Control

Texas Instruments’ new F28E12x MCUs deliver 30% more processing power, integrated analog, and advanced FOC features for smoother, quieter, and more efficient motor control in appliances and power tools.

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Infineon Adds High-SNR, Low-Power MEMS Microphones to XENSIV Lineup

Infineon’s IM72D128V and IM69D129F combine IP57 durability, low power draw, and precise digital audio for next-generation portable devices.

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NOVOSENSE NSUC1612 Motor Driver SoC Simplifies Automotive Actuator Design

NOVOSENSE’s NSUC1612 integrates MCU, drivers, and comms in one chip, cutting cost and complexity for next-generation automotive actuators.

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ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

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Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.

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