Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Samtec Launches Rugged Threaded SMPM Interconnects for High-Density RF Systems
Samtec’s threaded SMPM interconnects deliver rugged, high-density RF performance up to 65 GHz for aerospace and communication systems.
Read MoreJAE Launches MX81D 25 A Connector Series for High-Power Automotive ECUs
JAE’s MX81D connector handles up to 25 A with 2.8 mm terminals for high power automotive ECU applications.
Read MoreRECOM Launches Ultra Slim 90 W DIN Rail AC DC Supply for Surge Load Applications
RECOM’s 90 W DIN rail AC DC supply adds surge boost, high efficiency and Class 2 compliance for compact control systems.
Read MoreMelexis Launches Automotive-Grade SMD Infrared Sensor for EV Powertrain Thermal Monitoring
Melexis introduces the MLX90637, the first automotive-qualified SMD infrared temperature sensor for EV powertrain systems, offering fast non-contact thermal monitoring.
Read MoreSTMicroelectronics Launches STM32V8, the First 18nm MCU for High-Performance Industrial and Edge AI Systems
ST introduces the STM32V8, the first 18nm MCU featuring FD-SOI technology, PCM memory and an 800 MHz Cortex-M85 core for advanced industrial and edge AI applications.
Read MoreToshiba Launches Compact Automotive Gate Driver IC for Next Generation BLDC Motor Systems
Toshiba’s TB9084FTG gate driver IC supports compact three phase BLDC motor systems with built in sensing, protection and automotive grade reliability.
Read MoreST Expands STM32 AI Model Zoo With 140+ Edge AI Models for Physical AI Development
STMicroelectronics expands its STM32 AI Model Zoo with over 140 vision, audio and sensing models, new PyTorch support and improved workflow tools for embedded AI development.
Read MoreTDK Expands i7A Series With 1000 W DC-DC Buck Converters in a 1/16th Brick
TDK’s latest i7A DC-DC buck converters deliver up to 1000 W and 80 A in a compact 1/16th brick footprint, offering wide input ranges and efficiencies up to 99 percent.
Read MoreAOS Backs NVIDIA’s 800 VDC Power Architecture With SiC and GaN for Next-Generation AI Factories
AOS introduces SiC, GaN and MOSFET solutions to support NVIDIA’s 800 VDC architecture for high-efficiency AI data centers, from AC-to-DC conversion to rack-level power stages.
Read MoreMicron Delivers Automotive UFS 4.1 to Power Next-Generation AI-Driven Vehicles
Micron’s automotive UFS 4.1 brings G9 NAND performance, faster boot times and high endurance to support AI-enabled ADAS and intelligent mobility systems.
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