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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Samtec Launches Rugged Threaded SMPM Interconnects for High-Density RF Systems

Samtec’s threaded SMPM interconnects deliver rugged, high-density RF performance up to 65 GHz for aerospace and communication systems.

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JAE Launches MX81D 25 A Connector Series for High-Power Automotive ECUs

JAE’s MX81D connector handles up to 25 A with 2.8 mm terminals for high power automotive ECU applications.

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RECOM Launches Ultra Slim 90 W DIN Rail AC DC Supply for Surge Load Applications

RECOM’s 90 W DIN rail AC DC supply adds surge boost, high efficiency and Class 2 compliance for compact control systems.

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Melexis Launches Automotive-Grade SMD Infrared Sensor for EV Powertrain Thermal Monitoring

Melexis introduces the MLX90637, the first automotive-qualified SMD infrared temperature sensor for EV powertrain systems, offering fast non-contact thermal monitoring.

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STMicroelectronics Launches STM32V8, the First 18nm MCU for High-Performance Industrial and Edge AI Systems

ST introduces the STM32V8, the first 18nm MCU featuring FD-SOI technology, PCM memory and an 800 MHz Cortex-M85 core for advanced industrial and edge AI applications.

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Toshiba Launches Compact Automotive Gate Driver IC for Next Generation BLDC Motor Systems

Toshiba’s TB9084FTG gate driver IC supports compact three phase BLDC motor systems with built in sensing, protection and automotive grade reliability.

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ST Expands STM32 AI Model Zoo With 140+ Edge AI Models for Physical AI Development

STMicroelectronics expands its STM32 AI Model Zoo with over 140 vision, audio and sensing models, new PyTorch support and improved workflow tools for embedded AI development.

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TDK Expands i7A Series With 1000 W DC-DC Buck Converters in a 1/16th Brick

TDK’s latest i7A DC-DC buck converters deliver up to 1000 W and 80 A in a compact 1/16th brick footprint, offering wide input ranges and efficiencies up to 99 percent.

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AOS Backs NVIDIA’s 800 VDC Power Architecture With SiC and GaN for Next-Generation AI Factories

AOS introduces SiC, GaN and MOSFET solutions to support NVIDIA’s 800 VDC architecture for high-efficiency AI data centers, from AC-to-DC conversion to rack-level power stages.

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Micron Delivers Automotive UFS 4.1 to Power Next-Generation AI-Driven Vehicles

Micron’s automotive UFS 4.1 brings G9 NAND performance, faster boot times and high endurance to support AI-enabled ADAS and intelligent mobility systems.

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