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Synopsys Expands AI Capabilities For Chip Design Workflows

Synopsys has introduced new AI features across its EDA tools, from workflow assistants to automated verification and simulation with Ansys.

synopsys, eda, ai, generative ai, semiconductor design, verification, rtl, simulation, ansys, agentengineer

TDK 6-Axis IMU Targets Smartphone Optical Image Stabilization

TDK’s ICM-536xx MEMS IMU combines gyro and accelerometer data to improve optical image stabilization in smartphones, wearables, and AR/VR devices.

tdk, imu, mems sensor, optical image stabilization, smartphone camera, wearables, ar/vr, motion sensing, consumer electronics

EPC Highlights GaN Power Advances at PCIM Asia 2025

EPC will showcase GaN solutions for AI servers, robotics, and UAVs at PCIM Asia 2025, as momentum grows for GaN to replace silicon in high-frequency power.

epc, gan, power electronics, ai servers, data centres, robotics, uavs, drones, dc-dc conversion, pcim asia 2025

Rapidus May Have Surpassed Intel 18A Logic Density

As semiconductor nodes shrink to 2nm and beyond, does smaller always mean better? Can raw logic density now define performance more than transistor size? And as companies like Rapidus challenge Intel and TSMC, who will ultimately produce the most cost-effective, reliable devices for modern applications?

semiconductors, 2nm, 18a, rapidus, intel, tsmc, logic density, transistor scaling, bspdn, euv lithography, gaa, hd cell libraries, node shrink, 3d integration, chip manufacturing, process nodes, wafer production, high-density devices, performance-per-watt, atomic-scale transistors, advanced fabrication

UltraRAM Technology Now Volume Scales, The Future of Memory

As UltraRAM moves into production, many are left wondering if it could become the future memory technology. What challenges does memory face, what is UltraRAM, and could it be the solution for the future?

ultraram, unified memory, dram, nand flash, non-volatile memory, gallium antimonide, aluminum antimonide, epitaxy, resonant tunneling, memory hierarchy, semiconductor memory, memory scalability, high-speed memory, long-term data retention, memory endurance, memory architecture, cpu cache, storage technology, next-generation memory, memory production, memory innovation

EPC Launches Radiation-Hardened GaN Motor Drive Evaluation Board for Space Applications

The EPC7C021 from EPC Space is a compact, radiation-hardened GaN motor drive board for use in space and aerospace environments.

epc, gan, radiation hardened, motor drive, three phase, aerospace, robotics, evaluation board, motion control, power electronics, space systems, egan, reaction wheels, ion thrusters

Vishay Introduces MKP1848e DC-Link Capacitor For Harsh Environments

Vishay’s MKP1848e film capacitor handles +125 °C operation, 44.5 A ripple current, and AEC-Q200 qualification for EV, industrial, and energy power systems.

vishay, mkp1848e, dc-link capacitor, film capacitor, aec-q200, automotive electronics, ev, phev, power conversion, solar inverter, battery storage, ups

Würth Elektronik Adds New Packages to WE-CMDC Choke Series

Würth Elektronik expands its WE-CMDC chokes with compact 7060, 9070, 1513, and 1211 packages, offering high-current EMI suppression in tight spaces.

würth elektronik, we-cmdc, common-mode choke, emi suppression, dc/dc converter, aec-q200, automotive, industrial electronics, iot, poe

Littelfuse SZSMF6L TVS Diodes Deliver 600W Protection

Littelfuse introduces the SZSMF6L Series, compact 600 W TVS diodes that improve surge and ESD protection in EV and automotive systems.

littelfuse, tvs diode, automotive electronics, ev powertrain, surge protection, battery management, onboard charging, esd protection, aec-q101, sod-123fl

Marvell Validates Structera CXL Across CPUs and Memory Suppliers

Marvell’s Structera CXL controllers are now validated across AMD, Intel, Micron, Samsung, and SK hynix, a milestone for AI and data-centre memory.

marvell, cxl, compute express link, structera, amd, intel, micron, samsung, sk hynix, ddr5, ddr4, ai, data centres, memory expansion

Synopsys Expands AI Capabilities For Chip Design Workflows

TDK 6-Axis IMU Targets Smartphone Optical Image Stabilization

EPC Highlights GaN Power Advances at PCIM Asia 2025

Rapidus May Have Surpassed Intel 18A Logic Density

UltraRAM Technology Now Volume Scales, The Future of Memory

EPC Launches Radiation-Hardened GaN Motor Drive Evaluation Board for Space Applications

Vishay Introduces MKP1848e DC-Link Capacitor For Harsh Environments

Würth Elektronik Adds New Packages to WE-CMDC Choke Series

Littelfuse SZSMF6L TVS Diodes Deliver 600W Protection

Marvell Validates Structera CXL Across CPUs and Memory Suppliers

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