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STMicroelectronics Pushes 800 VDC Power Closer to AI GPUs

STMicroelectronics expands its 800 VDC power architecture with new 12V and 6V conversion stages, enabling more efficient power delivery closer to GPUs in high-density AI data center infrastructure.

STMicroelectronics, 800 VDC, data center power, AI infrastructure, GPU power delivery, high voltage distribution, DC power conversion, power architecture, server power design, GaN power, SiC power, power electronics, data center efficiency, GPU servers, power density

EPC’s EPC91202 GaN Inverter Board Pushes BLDC Drives to 150 kHz

EPC’s EPC91202 GaN inverter evaluation board delivers up to 50 ARMS phase current and 150 kHz PWM switching for high-density BLDC motor drive development in robotics, drones, and e-mobility systems.

Efficient Power Conversion, EPC, EPC91202, EPC2361, eGaN FET, gallium nitride power devices, GaN motor drives, BLDC inverter, three phase inverter, motor control electronics, robotics motor drives, drone propulsion electronics, eMobility motor drives, field oriented control, space vector PWM, power electronics

Synaptics SYN765x Brings Wi-Fi 7 and Edge AI to IoT Nodes

Synaptics introduces the SYN765x Wi-Fi 7 connectivity chip combining Bluetooth LE, Thread, and on-device AI processing. The device enables wireless sensing, Bluetooth channel sounding, and edge intelligence inside compact IoT systems.

Synaptics, SYN765x, WiFi 7 IoT chip, edge AI connectivity, Bluetooth LE 6, Thread Zigbee connectivity, wireless sensing CSI, Bluetooth channel sounding, AIoT hardware, RF connectivity SoC, IoT wireless processor, smart home connectivity, industrial IoT wireless, embedded connectivity chip, edge computing wireless, wireless AI platform

Texas Instruments TinyEngine NPU Pushes AI Into MCU Designs

Texas Instruments introduces MSPM0G5187 and AM13Ex microcontrollers integrating the TinyEngine NPU, enabling low-latency edge AI inference in embedded systems including motor control, wearables and industrial devices.

Texas Instruments, TinyEngine NPU, edge AI MCU, MSPM0G5187, AM13Ex, Arm Cortex M0 Plus, Arm Cortex M33, embedded AI, microcontroller AI accelerator, motor control MCU, industrial automation MCU, real time control systems, edge AI hardware, embedded machine learning, TI microcontrollers

STMicroelectronics ST64UWB Extends UWB Range for Secure Access

STMicroelectronics introduces the ST64UWB family supporting IEEE 802.15.4z and upcoming 802.15.4ab ultra-wideband standards with multi-millisecond ranging, improved link budget using 18 nm FD-SOI, and radar sensing capabilities for automotive and smart device applications.

STMicroelectronics, ST64UWB, ultra wideband, UWB chip, IEEE 802.15.4ab, IEEE 802.15.4z, digital car key, UWB radar sensing, child presence detection, wireless ranging, automotive UWB, smart access systems, UWB localization, FD SOI RF, embedded wireless systems

Researchers Develop New Semiconductor Defect Imaging Method

Researchers have developed a new imaging technique to identify semiconductor defects in cutting-edge wafers, a step towards error-free manufacturing for a high yield future.

semiconductor defects, semiconductor industry, advanced imaging systems, semiconductor foundries, transistor defects, wafer purity, semiconductor manufacturing, electron ptychography, 3D imaging technique, silicon wafer defects

NXP i.MX 93W Combines Edge AI Compute With Tri-Radio

NXP introduces the i.MX 93W applications processor combining a Cortex-A55 CPU, Ethos NPU delivering up to 1.8 eTOPS, and integrated Wi-Fi 6, Bluetooth LE, and 802.15.4 connectivity in a single SoC for edge AI systems.

NXP, i.MX 93W, applications processor, edge AI, neural processing unit, Arm Cortex A55, Arm Ethos NPU, WiFi 6, Bluetooth LE, 802.15.4, Thread, Matter, IoT processors, embedded processors, industrial IoT, edge computing, secure enclave, EdgeLock, wireless SoC

Infineon MOTIX SiP Shrinks Automotive Motor Control Boards

The Infineon MOTIX TLE9954QSW40-33 integrates MCU, power stage and motor driver functions in a compact SiP, reducing board size and improving thermal and EMC behavior for automotive pumps, fans and actuators.

Infineon, MOTIX, TLE9954QSW40, motor control, SiP, OptiMOS 7, automotive electronics, EV thermal systems, LIN control, FOC control, compact motor driver, three phase driver, MCU integration, thermal management, EMC performance

Bourns MF-LSMF Resettable Fuses Expand High-Power Protection Options

Bourns expands its MF LSMF PPTC resettable fuse line with higher hold currents, extended voltage ratings and ENIG plated SMD options designed for reliable protection in telecom, industrial and low voltage DC ports.

Bourns, resettable fuse, PPTC, MF LSMF, circuit protection, overcurrent protection, overtemperature protection, ENIG terminals, telecom power, USB power protection, IEEE 1394, PoE protection, industrial control, portable electronics, board level protection

Littelfuse CPC1343G Relay Strengthens High-Isolation Switching in Compact Designs

The Littelfuse CPC1343G OptoMOS solid state relay offers 900 mA load capability, reinforced 5000 VRMS isolation, fast switching, and extended temperature performance in compact DIP-4 and SMD packages for industrial and medical systems.

Littelfuse, CPC1343G, OptoMOS, solid state relay, SSR, reinforced isolation, 5000 VRMS, high current switching, DIP4 relay, SMD relay, medical electronics, industrial control, instrumentation, ATE, multiplexing, low drive current, extended temperature, high reliability switching

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