Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


binder M12 Connectors Add Tool-Friendly Coupling Rings

binder updates moulded, shielded M12 connectors with knurled and hexagonal coupling rings for tool-assisted assembly, controlled torque, and more consistent industrial installation.

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Littelfuse TVS Diodes Protect Automotive HV Rails

Littelfuse TPSMC, TPSMD, and TP5.0SMDJ automotive TVS diodes add high-voltage transient protection for EV BDUs, HVAC systems, PTC heaters, GaN/SiC MOSFETs, and IGBTs.

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Microchip Adds PQC Root Of Trust Controllers For Secure Boot

Microchip TS1800 and TS50x controllers add post-quantum-ready secure boot, hardware PQC acceleration, attestation, and root of trust support for infrastructure systems.

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u-blox ZED-X20P GNSS Module Adds Global PPP Support

u-blox ZED-X20P-01B GNSS module enables decimeter-level positioning using global PPP and Galileo HAS, reducing reliance on RTK infrastructure.

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STMicroelectronics Targets Always-On Vision With Low-Power Image Sensors

STMicroelectronics VD55G4 and VD65G4 bring ultralow power global shutter sensing to always-on vision systems in wearables, IoT, and embedded designs.

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Customers Asking Intel for Scrapped Dies to Help Ease CPU Supplies

Recently, an interesting report was released stating that Intel is now binning down and selling high-performance Xeon dies that would otherwise have been scrapped by customer requests. What challenges is the AI industry presenting to supplies, what exactly have customers asked of Intel, and what does this tell us about the ongoing situation?

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AI Designs and Verifies a RISC-V Processor From Scratch in 12 Hours

Recently, an agent-based AI was able to design and verify a RISC-V CPU from scratch in under 12 hours. How is AI becoming a critical engineering tool, what did the AI achieve, and what does this mean for the future of AI in engineering?

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Samsung Breaks the 10nm DRAM Barrier

Recently, Samsung announced that it has broken the 10nm barrier currently facing DRAM, allowing them to pack more DRAM cells per unit area. What challenges does DRAM shrinking face, what did Samsung develop, and why is this innovation so critical now?

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New RISC-V SBC Fights Against Raspberry Pi 5

Recently, a new SBC has been released that utilizes RISC-V, making it a viable contender for Raspberry Pi solutions. What challenges do SBC face, what features does the new machine offer, and could it help establish RISC-V as a better alternative for future SBCs?

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DigiKey and Microchip Webinar Covers CircuitPython vs Verilog

DigiKey and Microchip will host a free April 30 webinar covering CircuitPython and Verilog, showing how embedded systems combine software and hardware logic.

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