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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Infineon XENSIV TLE4978 Current Sensor Cuts Noise In Fast Power Loops
Infineon’s XENSIV TLE4978 is a coreless isolated magnetic current sensor combining Hall and coil sensing on one die, delivering 9 MHz bandwidth, low noise, fast overcurrent detection, and support for EV charging, DC-DC conversion, PV inverters, and AI server power.
Read MoreMaxLinear Retimer Extends Copper Reach In AI Racks
MaxLinear’s Annapurna is a 224Gbps-per-lane PAM4 scale-up retimer for AI data centers, designed to extend copper backplanes, AECs, and on-board links with DSP-based compensation for signal loss, reflections, and other channel impairments.
Read MoreSamtec AcceleRate Slim Cables Add More Flexible Signal Routing
Samtec’s AcceleRate Slim ARC6 cable assemblies now include single-ended and mixed-signaling options, extending their use in dense computing, FPGA prototyping, emulation, and MIPI systems while retaining the narrow body and direct-attach cable architecture.
Read MoreYAGEO Film Capacitors Target EMI Stress in WBG Power
YAGEO’s R41D V234 Series is a family of Y2/X1 metallized polypropylene film capacitors for EMI suppression in SiC and GaN power systems, offering 300 VAC rating, 1200 VDC recommendation, high dV/dt capability, and increased ripple current handling.
Read MoreRECOM AC/DC Module Pushes 65 W Into Less Space
RECOM’s RACM65S-K/277 is a compact 65 W AC/DC power module with 85 VAC to 305 VAC input, over 90% peak efficiency, multiple fixed outputs, and approvals for industrial, medical, and household applications.
Read MoreTE Connectivity MezzaWave Connectors Aim at Denser 56G Links
TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.
Read MoreAlpha and Omega Semiconductor MOSFETs Target AI Server Power Density
Alpha and Omega Semiconductor has introduced the AONC40202 and AONC68816 MOSFETs in DFN 3.3 x 3.3 double-sided cooling source-down packages for AI server Intermediate Bus Converter applications.
Read MoreNavitas Pushes 800 VDC Directly to 6 V in AI Power
Navitas introduces an 800 VDC to 6 V power delivery board that removes the intermediate bus stage, enabling direct high-voltage to low-voltage conversion for AI data center power systems.
Read MoreTI 800 VDC Power Architecture Reduces Conversion Stages
Texas Instruments introduces an 800 VDC power architecture aligned with NVIDIA that reduces AI data center power delivery to two stages, removing intermediate rails and shifting constraints toward high-density local conversion.
Read MoreSTMicroelectronics Pushes 800 VDC Power Closer to AI GPUs
STMicroelectronics expands its 800 VDC power architecture with new 12V and 6V conversion stages, enabling more efficient power delivery closer to GPUs in high-density AI data center infrastructure.
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