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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

SemiQ’s 1200 V QSiC Dual3 half-bridge modules combine low RDSon SiC MOSFETs, optional Schottky diodes, and high power density to help replace IGBT modules in data center cooling, energy storage, and industrial power converters.

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Toshiba Wettable-Flank MOSFETs Shift Package Priorities

Toshiba has launched five automotive MOSFETs in its DFN2020B(WF) package, combining wettable flanks, better AOI visibility, stronger solder-joint performance, and a smaller footprint for compact vehicle power designs.

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EPC GaN Inverter Board Targets Faster BLDC Prototyping

EPC’s EPC91121 gives engineers a compact three-phase GaN inverter platform for 24 V-class BLDC development, combining 50 ARMS output, integrated sensing, controller support, and switching up to 150 kHz.

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TI Pushes Isolated Power Density For EVs And Data Centers

TI’s UCC34141-Q1 and UCC33420 isolated power modules use IsoShield packaging to combine a planar transformer and isolated power stage, targeting compact automotive, industrial, and data center rails with up to 2 W output power.

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China Unveils Worlds-First 35 Micron Ultra-Thin Power Wafer Production Line

Recently, China announced that it has developed the world's thinnest power wafers at 35 microns. But why exactly does this matter, how has China achieved this, and what does it mean for the rest of the world?

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Renesas GaN Charging Topology Pushes Compact Power Higher

Renesas has expanded its AC/DC charging portfolio with a GaN-based half-wave LLC platform built around the RRW11011 and companion controllers, targeting compact 100 W to 500 W plus chargers with 5 V to 48 V output capability.

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u-blox JODY-W6 Opens Up 6 GHz For Industrial IoT

u-blox has launched the JODY-W6, a host-based industrial wireless module combining tri-band Wi-Fi 6E, 2x2 MIMO, Bluetooth Dual-Mode with LE Audio, secure boot, and EdgeLock for industrial and IoT applications.

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Toshiba Super Junction MOSFETs Cut Losses In Fast Power Stages

Toshiba’s DTMOSVI 600V HSD super junction MOSFETs add built-in fast-recovery diodes to reduce reverse recovery losses in SMPS, UPS, and photovoltaic power circuits, with package options including TO-247, TOLL, and DFN8×8.

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Kyocera Clock Oscillators Cut Jitter In AI Server Links

Kyocera’s X Series differential clock crystal oscillators target AI servers and other high-speed systems with typical phase jitter as low as 30 fs, LV-PECL and LVDS outputs, compact packages, and reduced power consumption.

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Infineon Expands AI Server Voltage Regulation With New Buck Controllers and PoLs

Infineon has expanded its AI server voltage regulation portfolio with XDPE1E digital multiphase buck controllers and TDA49720, TDA49712, and TDA49706 PMBus point-of-load regulators for core and non-core rails.

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