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Samtec AcceleRate Slim Cables Add More Flexible Signal Routing

Samtec’s AcceleRate Slim ARC6 cable assemblies now include single-ended and mixed-signaling options, extending their use in dense computing, FPGA prototyping, emulation, and MIPI systems while retaining the narrow body and direct-attach cable architecture.

Samtec, AcceleRate Slim, ARC6, ARF6, cable assembly, high-speed cable, mixed signaling, single-ended signaling, differential pair, FPGA prototyping, FPGA emulation, MIPI, 64 Gbps PAM4, PCIe 6.0, CXL 3.2, Eye Speed cable, Flyover cable, micro coax, twinax, signal integrity

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

TE Connectivity, MezzaWave, 56G connectors, 56 Gbps PAM4, cable assemblies, high-speed connectors, board-to-board connectors, open-pin-field array, edge AI, data centers, industrial automation, robotics, aerospace and defense, VITA 57.1, VITA 57.4, FMC, FMC+, ANSI, BGA, signal integrity, mezzanine connectors

Bourns RF Inductors Push High Frequency Stability Into Smaller Footprints

Bourns has introduced new multilayer chip inductors in compact case sizes with high SRF performance for RF amplifiers, wireless modules, radar, and communication systems, offering stable high frequency behavior with monolithic construction.

Bourns, multilayer inductors, RF inductors, microwave passives, CE0603G, CE0603M, CE1005Q, CE1608Q, high SRF inductors, wireless design, radar electronics, RF amplifiers, matching networks, mobile RF modules, signal integrity, broadband circuits, high frequency components

Keysight XR8 Scope Architecture Pushes High Speed Validation Forward

Keysight’s Infiniium XR8 oscilloscope introduces a new front end with integrated ADC and DSP processing, reducing noise, accelerating compliance testing, and improving workflow efficiency for high speed digital validation.

Keysight, Infiniium XR8, oscilloscope, high speed digital, signal integrity, jitter analysis, USB4v2 testing, DisplayPort 2.1, DDR5 validation, ADC design, DSP engine, compliance testing, electronic design, measurement tools, test and measurement, lab workflow

Molex Impress Moves 224G Links Onto the ASIC Substrate

Molex launches Impress Co-Packaged Copper, a compression-attached substrate connector delivering 224G PAM-4 near-ASIC connectivity to reduce PCB loss and support next-generation AI and hyperscale data center architectures.

Molex, Impress Co-Packaged Copper, co-packaged optics, co-packaged copper, 224G PAM-4, near ASIC connectivity, high-speed interconnect, data center networking, AI accelerators, hyperscale architecture, substrate connector, compression connector, SerDes, 3.2T networking, signal integrity, PCB loss reduction, high-density server design

Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

Samtec’s HSEC8 0.80 mm edge-card sockets use machined contacts to support high-speed, high-cycle modular systems.

Samtec, HSEC8, Generate series, edge card socket, 0.80 mm pitch, Edge Rate contact, high speed connector, signal integrity, modular systems, right angle connector, vertical connector, edge mount, power signal combo, PCB connector, datacom, telecom equipment, instrumentation, industrial electronics

Diodes PI2MEQX2505Q Improves MIPI D-PHY Signal Integrity In High Resolution Automotive Cameras

Diodes PI2MEQX2505Q restores MIPI D PHY signaling for high resolution automotive camera and ADAS systems with configurable equalization and low power modes.

Diodes Incorporated, PI2MEQX2505Q, ReDriver IC, MIPI D PHY, CSI2, DSI, signal integrity, equalization, pre emphasis, low power modes, automotive cameras, ADAS, high speed links, differential signaling, PCB routing, semiconductor, signal conditioning, camera systems, BEV electronics

Diodes PI5USB216EQ Boosts USB 2.0 Signal Integrity for Automotive Designs

The Diodes PI5USB216EQ strengthens USB 2.0 signals for longer automotive cable runs while supporting BC 1.2 CDP charging and flexible EQ control.

Diodes, PI5USB216EQ, USB 2.0, signal conditioner, ISI loss, equalisation, pre emphasis, BC 1.2 CDP, automotive USB, long cable runs, X2 QFN, USB PHY, signal integrity, interface IC, automotive electronics

JAE MX74A Brings 1000BASE-T1 Automotive Ethernet to Compact SDV Designs

JAE’s MX74A connectors add 1000BASE-T1 support for compact, high speed automotive Ethernet networks.

JAE, MX74A, MX74 Series, Automotive Ethernet, 1000BASE T1, 1 Gbps Ethernet, single pair Ethernet, SDV, ADAS, connectors, STP cable, Open Alliance, in vehicle networks, automotive connectors, signal integrity, ECU networking

Toshiba expands digital isolators for stable industrial control

Toshiba adds new dual channel digital isolators with high CMTI and low delay to improve signal reliability in noisy industrial environments.

toshiba, dcl52xx00, digital isolator, magnetic coupling, cmti, isolated uart, industrial automation, signal integrity, propagation delay, noise immunity, real time control, isolation barrier, power electronics

Samtec AcceleRate Slim Cables Add More Flexible Signal Routing

TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

Bourns RF Inductors Push High Frequency Stability Into Smaller Footprints

Keysight XR8 Scope Architecture Pushes High Speed Validation Forward

Molex Impress Moves 224G Links Onto the ASIC Substrate

Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

Diodes PI2MEQX2505Q Improves MIPI D-PHY Signal Integrity In High Resolution Automotive Cameras

Diodes PI5USB216EQ Boosts USB 2.0 Signal Integrity for Automotive Designs

JAE MX74A Brings 1000BASE-T1 Automotive Ethernet to Compact SDV Designs

Toshiba expands digital isolators for stable industrial control

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